Sensor Chip Alignment Using Segmented Bonding Sheets
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Solution Overview
Problem
In indirect-type radiation imaging apparatuses, positional shifts of sensor chips occur due to the bonding sheet entering the spaces between the chips during the assembly process, affecting the accuracy and reliability of the imaging system.
Innovation Solution
The use of separated bonding sheets to bond sensor chips to the sensor base, with specific arrangements to prevent positional shifts, such as using separate sheets for each row or column of sensor chips and positioning the bonding sheets to avoid contact between adjacent sheets, ensures accurate alignment and bonding of the sensor array.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a bonding sheet is used to bond the scintillator panel to the sensor panel, then the bonding process is simplified and manufacturing efficiency is improved, but the bonding sheet enters the spaces between sensor chips causing positional shifts and reducing manufacturing precision
Solution Approach 1:
The bonding sheet is divided into multiple separate bonding sheets, with each bonding sheet corresponding to individual sensor chips or groups of chips. This segmentation prevents the bonding sheet from entering the spaces between chips and causing positional shifts, while still enabling efficient bonding of the scintillator panel to the sensor panel.
2Measurement precision
If sensor chips are arranged in an array on a sensor panel, then the imaging resolution and quality are improved, but the complexity of aligning and bonding multiple chips increases device complexity
Solution Approach 1:
The sensor panel is segmented into multiple sensor chips that can be manufactured and tested independently, then bonded together using separate bonding sheets. This approach allows for modular assembly, reducing the overall complexity of handling and aligning a large array while maintaining high imaging resolution.
Solution Approach 2:
Separate bonding sheets act as intermediaries between the sensor chips and the scintillator panel, facilitating the assembly process. Each bonding sheet independently bonds individual chips or chip groups, simplifying the alignment and bonding operations compared to using a single large bonding sheet.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces positional shifts of sensor chips, maintaining the integrity and accuracy of the sensor array, thereby enhancing the performance and reliability of the radiation imaging apparatus.
Implementation Method 1
incident radiation is converted into visible light by a scintillator
Implementation Method 2
the visible light is converted into electrical signals by photoelectric conversion elements of a sensor panel
Data Source
Figure 1A~1C
Figure 2A~2B
Figure 3A~3C
AI summary
A radiation imaging apparatus (100, 300, 400, 500, 600, 700) includes a sensor base (101), a sensor array that includes a plurality of sensor chips (103) arranged in an array, and in which three or more sensor chips out of the plurality of sensor chips are arranged in one row of the sensor array, a scintillator (105) positioned on a side opposite to the sensor base with respect to the sensor array, a bonding member (104) that bonds the sensor array and the scintillator, and a plurality of bonding sheets (102) that are separated from each other and bond the sensor base and the plurality of sensor chips. Two adjacent sensor chips out of the three or more sensor chips are bonded to the sensor base using separate bonding sheets out of the plurality of bonding sheets.