Segmented Capacitor Pad Layout for Full Tin Coverage

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Solution Overview

Problem

The challenge in integrated circuit packages is that as components shrink, the tin layer thickness on capacitor pads is limited by the size of smaller bumps, leading to insufficient coverage and potential corrosion due to exposure of nickel and copper layers, especially for larger capacitor pads.

Innovation Solution

The solution involves fracturing capacitor pads into multiple smaller portions, each covered by a tin layer during reflow, with a frame to contain solder material and prevent overflow onto other components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the tin layer thickness is increased to ensure complete coverage of capacitor pads, then corrosion protection and connection reliability are improved, but the solder material may overflow onto other components due to the limited space constraints

Engineering Contradiction:

Improveconnection reliabilityVSAvoidsolder material overflow

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The capacitor pad is divided into multiple discrete pad portions instead of a single large pad. This segmentation allows each portion to be completely covered by the limited tin layer during reflow, preventing solder overflow while ensuring complete coverage and reliable connections for each segment

Inventive Principle:

Principle #1Segmentation

2Reliability

If the capacitor pad size is reduced to match the smaller bumps and pads, then the tin layer can provide complete coverage, but the electrical connection capability and current handling are reduced

Engineering Contradiction:

Improvetin layer coverageVSAvoidelectrical connection capability

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

The large capacitor pad is segmented into multiple smaller pad portions, each sized to receive complete tin coverage. The collective area of all pad portions maintains the total electrical connection capability equivalent to the original large pad, thus preserving current handling while ensuring complete tin coverage on each segment

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple discrete pad portions are electrically connected through the capacitor structure, effectively merging their electrical functionality. This allows the system to benefit from complete tin coverage on each small portion while maintaining the total electrical connection capability of a larger pad through the combined effect of all portions

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS12604748B2Capacitor pads and methods of manufacturing the same

Publication Date: 2026.04.14 INTEL CORP

AI summary

Capacitor pads and methods of manufacturing the same are disclosed herein. An example apparatus disclosed herein includes a substrate to support a die, and a die-side capacitor pad on the substrate, the die-side capacitor pad including a plurality of distinct pad portions, the distinct pad portions spaced apart from one another.