Segmented Electrostatic Chuck Layout for High-Resistance Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional bipolar electrostatic chucks (ESCs) struggle to effectively chuck high resistance substrates like epoxy, glass, or Si/glass due to high dielectric breakdown risk, uneven cooling, and difficulty in de-chucking, while large ESCs for large substrates are costly to manufacture.
Innovation Solution
The method involves forming interconnected grooves in a ceramic plate, depositing metal layers in these grooves to create electrodes, and filling them with dielectric material to form ESCs that can chuck high resistance substrates, with optional vacuum holes for additional clamping force, and a cooling plate for temperature regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If higher voltage potential is applied to chuck high resistance substrates, then chucking effectiveness is improved, but dielectric breakdown risk increases
Solution Approach 1:
The electrostatic chuck is divided into multiple separate electrodes (first electrode and second electrode) instead of using a single bipolar electrode. This segmentation allows independent voltage control of each electrode, enabling effective chucking of high resistance substrates while distributing the voltage stress to prevent dielectric breakdown.
2Force
If higher voltage potential is used for high resistance substrates, then chucking force is improved, but uniformity of backside gas pressure deteriorates
Solution Approach 1:
Different regions of the substrate are processed by separate electrodes with potentially different voltage settings, allowing local optimization of chucking force. This local control enables uniform gas pressure distribution across the substrate backside while maintaining adequate chucking force where needed.
3Reliability
If higher voltage potential is applied, then chucking of high resistance substrates is improved, but cooling uniformity deteriorates
Solution Approach 1:
The segmented electrode structure allows independent thermal management for different regions. Each electrode can be cooled separately, maintaining uniform temperature distribution across the substrate while enabling effective chucking of high resistance materials.
4Force
If higher voltage potential is used, then chucking force is improved, but de-chucking difficulty increases
Solution Approach 1:
The separate electrodes enable dynamic and independent control of voltage applied to each electrode. During de-chucking, voltages can be reduced or reversed in a controlled sequence, making substrate release easier while maintaining strong chucking force during processing.
5Area of stationary object
If conventional methods are used to manufacture large ESCs, then chucking capability is achieved, but manufacturing cost increases
Solution Approach 1:
The large electrostatic chuck is constructed from multiple separate electrode structures that can be manufactured independently using standard processes. These modular electrodes are then assembled to form a large-area chuck, reducing manufacturing cost while maintaining the required chucking capability for large substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides ESCs with high breakdown potential, effective chucking of high resistance substrates, and reduced manufacturing costs, enabling large ESCs without high-temperature processes, and allows for substrate flattening and efficient de-chucking.
Implementation Method 1
electrostatic chuck (ESC)... retaining a substrate or workpiece on a substrate support within a processing chamber, for example, using an electrostatic chuck (ESC)
Implementation Method 2
filling the plurality of first grooves and the plurality of second grooves with a dielectric material
Implementation Method 3
a cooling plate for temperature regulation
Data Source
AI summary
Methods of forming electrostatic chucks (ESCs) are provided herein. In some embodiments, a method of forming an electrostatic chuck (ESC) includes: forming a plurality of first grooves that are interconnected in a lower surface of a ceramic plate; forming a plurality of second grooves that are interconnected in the lower surface of the ceramic plate and that are separate from the plurality of first grooves; depositing a metal layer in the plurality of first grooves to form a first electrode and in the plurality of second grooves to form a second electrode; and filling the plurality of first grooves and the plurality of second grooves with a dielectric material.