Segmented Heat Spreader for Memory Module Thermal Management
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Solution Overview
Problem
High-density electronic modules, such as memory modules, face heat dissipation challenges that degrade performance and affect the reliability of advanced components like the advanced memory buffer (AMB), with existing heat spreaders either covering the entire module or focusing solely on the hottest components, leading to overheating of cooler components.
Innovation Solution
A heat spreader design with segmented thermal communication and isolation, using thermally conductive materials and airflow channels to efficiently draw heat from hotter components while avoiding overheating of cooler ones, maintaining a compact thickness suitable for conventional computer systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional heat spreader covers the entire module, then heat distribution across the module is improved, but hotter components still overheat and cooler components cannot be effectively cooled
Solution Approach 1:
The heat spreader is divided into multiple segments with different thermal properties. The first segment has high thermal conductivity to efficiently conduct heat away from hot components, while the second segment has lower thermal conductivity to provide thermal isolation and prevent heat transfer to cooler components. This segmentation resolves the contradiction by allowing different regions to perform different thermal functions.
Solution Approach 2:
Different portions of the heat spreader are assigned different thermal conductivities tailored to local requirements. The region adjacent to hot components uses high-conductivity material for efficient heat extraction, while regions near cooler components use low-conductivity material for thermal protection. This local differentiation simultaneously achieves effective cooling where needed and thermal isolation where protection is required.
2Reliability
If thermal isolation is provided between components, then cooler components are protected from overheating, but heat dissipation from hotter components is reduced
Solution Approach 1:
The heat spreader is divided into functionally distinct segments: the first segment provides high thermal conductivity pathways for efficient heat dissipation from hot components, while the second segment provides thermal isolation to protect cooler components. This segmentation allows the system to simultaneously achieve both heat dissipation and thermal protection without compromising either function.
Solution Approach 2:
Different regions of the heat spreader are engineered with different thermal conductivities to fulfill local functional requirements. High-conductivity material is placed where heat dissipation is critical, while low-conductivity material is placed where thermal protection is needed, thereby achieving both heat dissipation efficiency and cooler component protection simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat spreader effectively improves thermal management by efficiently cooling hotter components without overheating cooler ones, enhancing performance and reliability, as demonstrated by temperature simulations comparing conventional and segmented heat spreader configurations.
Implementation Method 1
heat spreader made of conductive metal, such as copper or aluminum, are used to distribute the dissipated heat across the surface of the module
Implementation Method 2
which is cooled by the system ventilation
Data Source
AI summary
A memory module is provided having a plurality of integrated circuit packages. The memory module includes a first thermal conduit in thermal communication with a first set of integrated circuit packages on the first side, and substantially thermally isolated from a second set of one or more integrated circuit packages on the first side. The memory module further includes a second thermal conduit in thermal communication with the set of one or more integrated circuit packages.