Segmented Heat Spreader Channels for Thermal Crosstalk
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Solution Overview
Problem
High-power integrated circuit packages face thermal management challenges due to thermal crosstalk, where heat from high-power components like CPUs and GPUs is transferred to lower-power components like memory, potentially damaging or degrading their performance.
Innovation Solution
An integrated heat spreader design with independent channel structures made of high thermal conductivity materials, such as copper or silver, is used, where each channel structure is isolated from others by low thermal conductivity framing material, allowing for customized cooling flows to prevent heat transfer between different chip areas within a package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single integrated heat spreader is used to cool multiple chips, then cooling coverage is improved, but thermal crosstalk between chips increases
Solution Approach 1:
The heat spreader is divided into multiple independent channel structures, each serving a specific chip area. The first channel structure serves the first die area while the second channel structure serves the second die area, preventing thermal coupling between adjacent chips through physical separation of cooling channels.
Solution Approach 2:
Each channel structure is independently configured with specific thermal conductivity properties and cooling flow rates tailored to the thermal requirements of its corresponding chip area. High-power chips receive channels with higher thermal conductivity and greater cooling capacity, while low-power chips receive appropriately scaled cooling.
2Loss of energy
If high thermal conductivity material is used in the heat spreader, then heat removal efficiency is improved, but heat transfer to adjacent areas increases
Solution Approach 1:
The heat spreader uses high thermal conductivity materials within each independent channel structure to efficiently remove heat from its corresponding chip, while the segmentation into separate channels prevents this efficient heat transfer from affecting adjacent chip areas.
Solution Approach 2:
Different channel structures use different thermal conductivity materials or configurations optimized for their specific chip's power density requirements, allowing each area to have optimal heat removal without compromising thermal isolation from other areas.
3Loss of energy
If cooling flow rate is increased to cool high-power chips, then heat removal is improved, but temperature in adjacent low-power chip areas increases
Solution Approach 1:
The cooling system is segmented into independent flow channels, allowing each channel to have its own optimized flow rate. The first channel structure can receive higher cooling flow for high-power chips while the second channel structure receives lower flow appropriate for low-power chips, eliminating thermal interference between adjacent cooling zones.
Solution Approach 2:
Each channel structure is configured with local cooling parameters (flow rate, thermal conductivity, channel geometry) matched to the specific thermal load of its corresponding chip area, enabling differentiated thermal management across the package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces thermal crosstalk, allowing for efficient cooling of high-power components while maintaining lower temperatures in lower-power components, optimizing thermal management and preventing overheating issues.
Implementation Method 1
Each channel structure can be implemented with metal having a high thermal conductivity (e.g., copper or silver)
Implementation Method 2
The channel structures can be used in conjunction with liquid-based cooling or air-based cooling, where either cooling liquid or air flows through the respective channel structures
Implementation Method 3
The frame can be implemented with low thermal conductivity molding compound or plastic so the heat transfer from one channel structure to another is inhibited
Data Source
AI summary
An integrated heat spreader includes channel structures assembled in a frame. Each channel structure is independent of the other, and can be used to dissipate heat from integrated circuitry at a specific location within a package, and without allowing heat from that particular location to propagate to integrated circuitry at other locations within the package. Each channel structure can be implemented with metal having a high thermal conductivity (e.g., copper). The channel structures can be used in conjunction with liquid-based cooling or air-based cooling. The frame can be implemented with low thermal conductivity molding compound or plastic so the heat transfer from one channel structure to another is inhibited. The channel structures can have different configurations (e.g., straight, pillars, and/or pin fins) to provide different rates of flow, mixing, and/or cooling. The flow direction of air or liquid for the channel structures can be the same (parallel) or different (counter).