Segmented Heat Spreading Plate for Chip Package Thermal Isolation
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Solution Overview
Problem
Miniaturization of semiconductor products leads to increased heat production, requiring effective heat dissipation methods to prevent overheating and ensure stability and longevity, as different working chips in composite chip modules generate varying amounts of heat.
Innovation Solution
A heat spreading plate with a main body of spaced metal sheets and an isolating frame, where the metal sheets are thermally connected to chips and the isolating frame surrounds the edges, forming gaps to separate sheets and reduce heat transfer, with a reinforced frame and three-dimensional structures for enhanced connectivity and structural strength, using materials with matching thermal expansion coefficients and high thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple working chips are integrated in a composite chip module, then product functionality is enhanced, but heat production increases and heat dissipation becomes more difficult
Solution Approach 1:
The heat spreading plate is divided into multiple independent metal sheets that are spaced apart from each other. Each metal sheet corresponds to a specific working chip and can independently conduct heat away from that chip. This segmentation allows different chips with different heat generation characteristics to have dedicated heat dissipation paths, effectively managing the thermal load while maintaining the multi-functional composite chip module structure.
2Temperature
If metal sheets are arranged close together to cover all chips, then heat dissipation coverage is improved, but heat transfer between adjacent chips occurs causing instability
Solution Approach 1:
The heat spreading plate consists of multiple separate metal sheets with gaps between them, rather than a single continuous sheet. This segmentation physically isolates the heat conduction paths of adjacent chips, preventing heat from one chip from transferring to neighboring chips through the heat spreading plate, thereby maintaining chip stability while still providing effective heat dissipation coverage.
Solution Approach 2:
The isolating frame serves as an intermediary structure that holds the metal sheets in spaced arrangement. It provides mechanical support to maintain the gaps between metal sheets while allowing each sheet to perform its heat dissipation function independently. The isolating frame mediates between the need for close chip arrangement and the need for thermal isolation.
3Reliability
If gaps are formed between metal sheets to prevent heat transfer, then chip stability is improved, but structural strength of the heat spreading plate is reduced
Solution Approach 1:
The isolating frame acts as a mediator that provides structural support to the spaced-apart metal sheets. It holds the sheets in their designated positions and maintains the gaps between them while contributing to the overall structural integrity of the heat spreading plate assembly, thus preventing strength loss despite the presence of gaps.
Solution Approach 2:
The heat spreading plate combines different materials - metal sheets for thermal conduction and isolating frame material for structural support and thermal isolation. This composite structure leverages the advantages of each material: metal sheets provide efficient heat dissipation while the isolating frame provides structural strength and thermal barrier functionality.
4Temperature
If different heat dissipation methods are used for different chips, then heat dissipation effectiveness is improved, but device complexity increases
Solution Approach 1:
Each metal sheet can be locally optimized for the specific thermal requirements of its corresponding chip. The heat spreading plate provides a uniform yet adaptable structure where local modifications (such as varying sheet thickness, material properties, or surface characteristics) can be made to match the heat generation characteristics of individual chips, achieving effective heat dissipation without complex overall system design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively improves heat dissipation performance while reducing heat transfer between metal sheets, ensuring stable operation and extended product life by matching heat dissipation with varying chip heat production.
Implementation Method 1
The main body includes a plurality of metal sheets which are arranged spaced apart from one another totally, and capable of thermally connecting different working chips mounted within the chip package structure, respectively
Implementation Method 2
a gap is formed between any two neighboring ones of the metal sheets to completely separate the two neighboring ones of the metal sheets
Implementation Method 3
The isolating frame surrounds outer edges of the metal sheets and fills into the gaps for fixedly holding the metal sheets together
Data Source
AI summary
A heat spreading plate is suitable to be a top cover of a chip package structure. The heat spreading plate includes a main body and an isolating frame. The main body includes a plurality of metal sheets which are arranged spaced apart from one another totally and capable of thermally connecting different working chips mounted within the chip package structure, respectively. A gap is formed between any two neighboring ones of the metal sheets to completely separate them. The isolating frame surrounds the outer edges of the metal sheets and fills into the gaps for fixedly holding the metal sheets together. One surface of the isolating frame is formed with a plurality of hollow recesses, and each of the metal sheets is exposed outwards from one of the hollow recesses.