Segmented LED Interconnects With Transparent Cross-Segment Routing

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Solution Overview

Problem

Providing reliable interconnections for densely packed light-emitting diodes (LEDs) is challenging, especially when each device must be separately addressable, due to their compact size and high density.

Innovation Solution

A segmented LED interconnect system is developed, featuring optically transparent conductive lines attached to multiple n-layers of LED segments, with conductive lines connected to p-layers and a wire bond, allowing for selective light emission from single or multiple segments using a crossbar or other electrical connection schemes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If LEDs are densely packed to increase device density, then productivity and space utilization are improved, but manufacturing precision and reliability of interconnections deteriorate

Engineering Contradiction:

Improvedevice densityVSAvoidinterconnection precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent divides the LED structure into segmented regions with isolation regions separating adjacent LEDs. This segmentation allows each LED to be independently addressed while maintaining high density packing, resolving the contradiction by enabling precise control and connection for each individual LED even in densely packed configurations

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces transparent conductive layers that extend across multiple LED segments in the horizontal plane, rather than only vertical connections. This dimensional approach allows interconnections to span across isolation regions, improving manufacturing feasibility while maintaining high device density

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Illumination intensity

If transparent conductive layers are used to improve optical performance, then light emission quality is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvelight emission qualityVSAvoidmanufacturing complexity

Core Design Contradiction:

Illumination intensityVSDevice complexity

Solution Approach 1:

The transparent conductive layer serves multiple functions simultaneously: it provides electrical connection between segments, acts as an optical window for light emission, and serves as a structural element in the interconnect system. This multi-functionality reduces overall device complexity despite the advanced materials used

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines the electrical connection function and optical transmission function into a single transparent conductive layer, rather than using separate layers for each function. This merging simplifies the manufacturing process while achieving both electrical connectivity and optical performance

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS11742378B2High density interconnect for segmented LEDs

Publication Date: 2023.08.29 ADEIA SEMICONDUCTOR INC

AI summary

A light emitting diode (LED) may include a conductive via in a first portion of an epitaxial layer and a first contact on a second portion of the epitaxial layer. The first portion and the second portion may be separated by an isolation region. The LED may include a transparent conductive layer on the epitaxial layer.