Segmented Movable Plate Die Detachment Device for Thin Chips
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional die detachment tools are unsuitable for thin semiconductor chips due to pinching effects and deformation, which can lead to cracking or breaking, especially when the chip thickness is reduced below 100 microns, as they apply excessive stress and lack adequate support during the detachment process.
Innovation Solution
A die detachment device featuring a plurality of movable plates with quadrilateral-shaped contact surfaces that form a continuous, flat contact surface to support the chip, minimizing deformation and stress by evenly distributing peeling energy across the chip's surface, and using vacuum suction to hold the chip during detachment and transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional needle-type ejector pins are used to detach a die from adhesive film, then the die can be detached and picked up, but the thin die (below 100 microns) experiences pinching effects and deformation leading to cracking or breaking
Solution Approach 1:
The ejector mechanism is segmented from a single needle-type pin into multiple push-up pins arranged in an array. This segmentation distributes the detachment force across multiple contact points, preventing localized pinching and deformation that causes cracking in thin dies during detachment from adhesive film.
Solution Approach 2:
The push-up pins are specifically designed with optimized spacing and arrangement patterns that adapt to the local geometry of thin dies. The pins are positioned to provide uniform support across the die surface, creating locally optimized force distribution that prevents deformation while maintaining effective detachment capability for dies below 100 microns thickness.
2Volume of moving object
If the thickness of semiconductor die is reduced to below 100 microns to minimize package height, then high density electronic devices can be achieved, but the die becomes susceptible to damage during detachment due to excessive stress and lack of support
Solution Approach 1:
Multiple push-up pins are positioned in advance to contact the die surface before detachment force is applied. This preliminary positioning ensures that support and force distribution are established before the detachment process begins, preventing excessive stress concentration and deformation in ultra-thin dies during the critical detachment phase from adhesive film.
Solution Approach 2:
The push-up pins are designed to move dynamically during the detachment process, adjusting their positions and force application in response to the die's deformation characteristics. This dynamic adjustment allows the system to maintain optimal support and force distribution throughout the detachment sequence, ensuring reliability for dies with thicknesses below 100 microns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces deformation and increases peeling energy, allowing for reliable detachment of thin semiconductor chips without cracking, by providing maximum support and minimizing pinching effects, thus enabling the handling of chips as thin as 0.8-2 mils (20-50 microns) without damage.
Implementation Method 1
each movable plate being movable relative to the other movable plates towards and away from the die
Implementation Method 2
using vacuum suction to hold the chip during detachment and transfer
Data Source
AI summary
A die detachment device for delaminating a die which is mounted at a position on an adhesive film comprises a plurality of movable plates having quadrilateral-shaped contact surfaces which are arranged adjacent to one another. The plurality of movable plates comprises an intermediate movable plate and outer movable plates on opposite sides of the intermediate movable plate. The contact surfaces of the movable plates together form a combined contact surface for supporting the adhesive film at the position of the die, each movable plate being movable relative to the other movable plates towards and away from the die.