Segmented Shield Kit for Sputtering Chamber Throughput

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Solution Overview

Problem

Existing substrate process chambers face throughput issues due to the undesirable disappearing anode effect caused by dielectric material sputtered from the sputtering target covering the grounded shield, requiring a metal pasting step that halts processing.

Innovation Solution

A process kit with a non-conductive upper shield and a conductive lower shield, where the non-conductive upper shield absorbs most of the dielectric material sputtered from the sputtering target, allowing the conductive lower shield to maintain its anode function for a longer period without the need for a pasting step.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a grounded shield is used in the process chamber, then the shield can act as an anode, but the dielectric material sputtered from the sputtering target covers the shield causing the disappearing anode effect

Engineering Contradiction:

Improveanode functionVSAvoidprocessing time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The shield is divided into two separate components: a non-conductive upper shield that surrounds the sputtering target and a conductive lower shield that acts as the anode. This segmentation prevents the dielectric material from covering the conductive lower shield, maintaining its anode function without requiring pasting steps.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The non-conductive upper shield acts as an intermediary that absorbs the dielectric material sputtered from the sputtering target, protecting the conductive lower shield from contamination and preventing the disappearing anode effect.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If a metal pasting step is performed to restore the shield's anode function, then the shield can act as an anode again, but processing must be halted reducing throughput

Engineering Contradiction:

Improveanode functionVSAvoidthroughput

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

By segmenting the shield into non-conductive upper and conductive lower portions, the system eliminates the need for periodic pasting steps, allowing continuous processing and maintaining high throughput while preserving the anode function.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The conductive lower shield maintains its anode function continuously without interruption, eliminating the need to halt processing for pasting steps, thereby ensuring continuous productive operation.

Inventive Principle:

Principle #20Continuity of useful action

3Reliability

If the conductive shield is placed close to the sputtering target, then it can effectively act as an anode, but it becomes covered by dielectric material more quickly

Engineering Contradiction:

Improveanode functionVSAvoidanode function duration

Core Design Contradiction:

ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The segmented shield configuration allows the conductive lower shield to be positioned effectively as an anode while the non-conductive upper shield protects it from rapid contamination, extending the duration of anode function.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The non-conductive upper shield serves as a protective intermediary that absorbs sputtered dielectric material, preventing it from reaching and covering the conductive lower shield, thereby extending the operational duration of the anode function.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly improves the throughput of the process chamber by extending the time the conductive shield can act as an anode, reducing the frequency of necessary pasting steps and maintaining efficient processing.

Implementation Method 1

dielectric material sputtered from the sputtering target covers the grounded shield

Methodology Applied

Scientific EffectSputtering: Sputtering

Implementation Method 2

the conductive lower shield to maintain its anode function for a longer period

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10886113B2Process kit and method for processing a substrate

Publication Date: 2021.01.05 APPLIED MATERIALS INC

AI summary

Embodiments of process kits for process chambers and methods for processing a substrate are provided herein. In some embodiments, a process kit includes a non-conductive upper shield having an upper portion to surround a sputtering target and a lower portion extending downward from the upper portion; and a conductive lower shield disposed radially outward of the non-conductive upper shield and having a cylindrical body with an upper portion and a lower portion, a lower wall projecting radially inward from the lower portion, and a lip protruding upward from the lower wall. The cylindrical body is spaced apart from the non-conductive upper shield by a first gap. The lower wall is spaced apart from the lower portion of the non-conductive upper shield by a second gap to limit a direct line of sight between a volume within the non-conductive upper shield and the cylindrical body of the conductive lower shield.