Segmented Sputtering Target Composition for Uniform Thin Films
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Solution Overview
Problem
Existing thin film deposition processes in semiconductor devices, such as display devices, suffer from non-uniformity in thin film composition, leading to characteristic deviations and reduced yield and efficiency in manufacturing.
Innovation Solution
A sputtering target with segmented sputtering target segments having different composition ratios in edge and central portions, specifically varying the zinc, indium, and gallium content, is used to enhance uniformity of thin films deposited on a target substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a uniform composition ratio is used throughout the sputtering target, then the manufacturing process is simple, but the thin film uniformity deteriorates
Solution Approach 1:
The sputtering target is divided into multiple segments (first sputtering target segment and second sputtering target segment) with different composition ratios. The first segment has a higher zinc content (4-7% higher) and lower indium-gallium content (2-5% lower) compared to the second segment. This segmentation allows different regions of the target to compensate for position-dependent deposition variations, improving overall thin film uniformity.
Solution Approach 2:
Different regions of the sputtering target are assigned different composition ratios tailored to their specific deposition characteristics. The first segment (typically at edges or specific positions) has adjusted composition to compensate for local deposition non-uniformity, while the second segment maintains the base composition. This local optimization ensures uniform thin film properties across the entire substrate area.
2Manufacturing precision
If the composition ratio is varied in different segments, then the thin film uniformity improves, but the manufacturing complexity increases
Solution Approach 1:
The target is segmented into manufacturable units with distinct composition ratios. The first segment containing higher zinc content can be manufactured separately and then assembled with the second segment, making the complex composition profile achievable through modular manufacturing processes rather than requiring complex single-piece fabrication.
3Reliability
If a single composition ratio is used, then the target structure is simple, but characteristic deviations occur in the manufactured devices
Solution Approach 1:
The target incorporates local composition variations where the first segment has enhanced zinc content (4-7% higher) and reduced indium-gallium content (2-5% lower) compared to the second segment. This local composition optimization compensates for position-dependent deposition non-uniformity, ensuring consistent device characteristics across the entire substrate regardless of where the thin film is deposited.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the uniformity of thin films, enhancing manufacturing efficiency and reducing manufacturing costs by minimizing characteristic deviations in semiconductor devices.
Implementation Method 1
A sputtering target with segmented sputtering target segments having different composition ratios in edge and central portions, specifically varying the zinc, indium, and gallium content, is used to enhance uniformity of thin films deposited on a target substrate.
Data Source
AI summary
A sputtering apparatus according to an embodiment includes a chamber providing a sputtering space, a sputtering target mounted in the chamber, and including a sputtering material, and a target substrate facing the sputtering target, wherein the sputtering target includes a first sputtering target segment disposed in a first portion and a second sputtering target segment disposed in a second portion, and a composition ratio of the sputtering material in the first sputtering target segment is different from a composition ratio of the sputtering material in the second sputtering target segment.