Selective Heat Curing for Precise Semiconductor Part Attachment
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Solution Overview
Problem
Existing semiconductor attachment methods using heat sources, such as ovens or reflow furnaces, apply uniform heat, leading to property changes in semiconductor parts that do not require heating and result in alignment errors due to the random flow of melted solder, which complicates the precise mounting of multiple clips on small metal pads.
Innovation Solution
An apparatus that includes a substrate loading unit, semiconductor part loader, vision examination unit, picker, adhesive hardening unit, and unloading unit, which selectively applies heat only to the semiconductor units that need it, allowing for temperature differences and precise adhesive hardening, thereby minimizing property changes and improving alignment accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If uniform heat is applied to the whole substrate using an oven or reflow furnace, then mass production is facilitated, but properties of semiconductor parts that do not require heating are adversely affected
Solution Approach 1:
The substrate is divided into multiple heating zones with independent temperature control. Each zone can be heated separately according to the specific requirements of different semiconductor parts, allowing selective heating without affecting other parts that do not require heating.
Solution Approach 2:
Different regions of the substrate are provided with different thermal conditions. The heating apparatus applies heat locally to specific areas where semiconductor parts require it, while maintaining different temperature conditions in other regions to preserve parts that should not be heated.
2Strength
If solder is melted in a reflow furnace, then attachment is achieved, but alignment error increases due to random flow of melted solder
Solution Approach 1:
The heating rate and temperature profile are precisely controlled to manage solder flow characteristics. By adjusting these parameters, the solder is melted and flows in a controlled manner rather than randomly, reducing alignment errors while achieving proper attachment.
3Productivity
If multiple clips are simultaneously mounted on small metal pads, then production efficiency is improved, but mount tolerance increases making precise alignment difficult
Solution Approach 1:
The mounting process is divided into multiple sequential stages rather than simultaneous mounting. Clips are mounted in groups or individually across different heating zones at different times, allowing precise alignment for each mounting operation while maintaining overall production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces property changes in semiconductor parts by controlling heat application, enabling precise attachment of semiconductor parts with improved alignment and facilitating continuous connection with subsequent equipment processes, enhancing operational efficiency.
Implementation Method 1
the adhesive hardening unit restrictively transmits a heat source only to at least one semiconductor unit, which is to be hardened, so that a temperature difference occurs between the semiconductor units, to which the heat source is supplied, and the semiconductor units, to which the heat source is not supplied
Data Source
AI summary
Provided is an apparatus for attaching semiconductor parts. The apparatus includes a substrate loading unit, at least one semiconductor part loader, a first vision examination unit, at least one semiconductor part picker, at least one adhesive hardening unit, and a substrate unloading unit, wherein the substrate loading unit supplies a substrate on which semiconductor units are arranged, the at least one semiconductor part loader supplies semiconductor parts, the first vision examination unit examines arrangement states of the semiconductor units, the at least one semiconductor part picker mounts semiconductor parts in the semiconductor units, the at least one adhesive hardening unit hardens and attaches adhesives interposed between the semiconductor units and the semiconductor parts, and the substrate unloading unit releases the substrate on which semiconductor parts are mounted. The adhesive hardening units restrictively transmit a heat source only to at least one semiconductor unit, which is to be hardened.