Selective Overmolding Barriers for Exposed Variable-Height Components
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Solution Overview
Problem
Current encapsulation processes in semiconductor packaging face challenges in protecting optical and temperature-sensitive components, as the molding compound can interfere with light transmission and reception and expose components to harmful thermal processes, leading to diminished performance and reliability.
Innovation Solution
The implementation of a barrier within the electronic package that prevents the molding compound from penetrating and encapsulating internal components, while allowing external components to be encapsulated, using a low-temperature encapsulation process for sensitive components and a high-temperature process for others, thereby maintaining optimal performance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a molding compound is used to encapsulate components during the encapsulation process, then mechanical protection and structural integrity are improved, but optical components suffer from degraded light transmission and temperature-sensitive components experience thermal damage
Solution Approach 1:
The patent divides the encapsulation process into two distinct segments: a first encapsulation process for temperature-sensitive optical components using a first molding compound with low-temperature curing, and a second encapsulation process for other components using a second molding compound with high-temperature curing. This segmentation allows each component type to receive appropriate protection without exposure to harmful conditions
Solution Approach 2:
The patent applies different molding compounds with different thermal and optical properties to different regions of the package. The first molding compound is specifically formulated for optical components requiring light transmission and low-temperature processing, while the second molding compound is optimized for mechanical strength in non-optical regions. This local differentiation resolves the contradiction by providing tailored protection to each component type
2Ease of manufacture
If all components are encapsulated together in a single high-temperature process, then manufacturing simplicity is maintained, but temperature-sensitive components suffer performance degradation
Solution Approach 1:
The manufacturing process is segmented into two sequential encapsulation operations. The first encapsulation uses a molding compound that cures at low temperatures (e.g., UV-curable or room-temperature curing compounds) to protect temperature-sensitive optical components. The second encapsulation subsequently applies a different molding compound at higher temperatures for other components. This segmentation maintains manufacturing feasibility while protecting sensitive components
Solution Approach 2:
The patent performs preliminary encapsulation of temperature-sensitive optical components before subjecting the package to high-temperature processing. By enclosing these components in a thermally protective first molding compound that cures at low temperatures, the system prevents thermal damage during subsequent high-temperature encapsulation of other components, thus maintaining both reliability and manufacturing efficiency
Data Source
AI summary
Packages and methods of assembly are described in which barriers are utilized during overmolding to improve volumetric efficiency. In one embodiment, a barrier includes multiple variable height components located on an interior of the barrier, where the barrier prevents the variable height components from being overmolded during the encapsulation process. In one embodiment, a barrier includes a camera module mounted on an image sensor located on an interior of the barrier, where the barrier prevents the camera module and image sensor from being overmolded during the encapsulation process. In an embodiment, a barrier is mounted on a secondary tier with the secondary tier mounted on a primary tier, where the barrier prevents multiple connector components located on an interior of the barrier from being overmolded during the encapsulation process.