Selective Vacuum Nozzle Handling for Defect-Free Microdevice Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for transferring micrometric electronic devices, such as light-emitting diodes, are inefficient as they either result in the transfer of defective devices, leading to black spots on screens, or are costly and time-consuming due to the need for selective picking and placement, and lack the ability for selective transfer of functional devices.
Innovation Solution
A handling system comprising a suction chamber with vacuum nozzles and shutter elements that can be selectively controlled to grip or release devices, allowing for the selective transfer of functional micrometric devices using microelectromechanical systems and electronic control circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If compression or thermocompression transfer is used to transfer a large quantity of LEDs, then transfer efficiency is improved, but defective LEDs are transferred causing black spots on the final device
Solution Approach 1:
The patent implements preliminary functional testing of LEDs before transfer using integrated photodiodes to detect light emission. This preliminary action allows the system to identify and exclude defective LEDs prior to transfer, preventing black spots on final devices while maintaining mass transfer efficiency through automated selection
Solution Approach 2:
The system uses self-emitting properties of functional LEDs and self-detecting properties of integrated photodiodes to automatically identify functional devices. This self-service mechanism enables selective transfer without manual inspection, resolving the contradiction between automated mass transfer and defect prevention
2Reliability
If pick and place method is used to transfer LEDs individually, then selective transfer of functional devices is achieved, but transfer speed becomes very slow increasing manufacturing costs
Solution Approach 1:
The patent merges mass transfer capability with selective transfer by combining array-based handling with integrated photodiode detection. Multiple LEDs are tested and transferred simultaneously in parallel, achieving both high selectivity through photodiode detection and high productivity through array processing, eliminating the need for slow individual pick-and-place operations
Solution Approach 2:
The system performs continuous functional testing and transfer operations in parallel across LED arrays. The photodiode array continuously detects functional LEDs while transfer mechanisms continuously move selected devices, maintaining continuous productive action rather than sequential individual operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the efficient and selective transfer of micrometric devices, reducing the risk of transferring defective units and minimizing costs by allowing for the precise manipulation and placement of functional devices, thereby improving the manufacturing process.
Implementation Method 1
a vacuum is applied to the nozzles so that they can suck up the electronic devices to be transferred
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to a handling system (1) for handling micrometric devices (3), the handling system (1) comprising a main body (10) internally delimiting a suction chamber (13), suction nozzles (31) comprising a suction channel (33) opening on one side into the suction chamber (13), and on the other side at a gripping end (37) intended to be in contact with a micrometric device (3); sealing elements (51), configured to seal a suction nozzle (31) so as to prevent the gripping of a micrometric device (3) or to allow fluidic communication between a gripping opening (o37) of the gripping end (37) and the suction chamber (13), so as to allow the gripping of a micrometric device (3) in contact with said gripping end (37).The invention also relates to a manipulation method for manipulating micrometric devices (3) by such a manipulation system (1).