Self-Destructing Photodiode with Triggered Heater
Solution Overview
Problem
Existing electronic systems lack the capability to physically self-destruct in a controlled, triggerable manner, which is essential for applications like security and supply chain integrity.
Innovation Solution
A self-destructing device is developed with a stressed substrate thermally coupled to a heater, powered by a power source and trigger circuitry that includes a sensor and switch. The sensor generates a trigger signal upon exposure to a stimulus, activating the switch to couple the power source to the heater, causing the substrate to self-destruct by fracturing into small pieces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a self-destructing device is designed with a stressed substrate and heater system, then the capability for controlled self-destruction is achieved, but the device complexity increases
Solution Approach 1:
The patent combines multiple functional layers (electrode layers, doped layers, intrinsic layers) into a single integrated photodiode structure that serves both as the self-destruct mechanism and as a functional electronic component. This merging reduces overall device complexity while maintaining the controlled self-destruction capability through the stressed substrate and heater system.
Solution Approach 2:
The photodiode structure serves multiple functions: it acts as a functional sensor/detector, provides the heater element for thermal stimulation, and forms part of the stressed substrate system that enables controlled self-destruction. This multi-functionality eliminates the need for separate components, thereby reducing device complexity.
2Manufacturing precision
If multiple layers are deposited and patterned to form the photodiode, then the manufacturing precision is improved, but the manufacturing process complexity increases
Solution Approach 1:
The photodiode is constructed by segmenting the manufacturing process into distinct sequential steps: depositing electrode layers, depositing doped layers, depositing intrinsic layers, and patterning. This segmentation allows each layer to be precisely controlled and deposited with specific parameters, improving manufacturing precision while making the overall complex process manageable through systematic breakdown.
Solution Approach 2:
The patent employs preliminary actions by pre-depositing multiple layers (electrode layers, doped layers, intrinsic layers) in a specific sequence before final patterning. This preliminary layer deposition establishes the structural foundation and material properties needed for precise subsequent patterning operations, improving overall manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively self-destructs in a controlled manner, ensuring security and integrity by rendering components inaccessible or non-functional, suitable for applications requiring secure disposal or tamper-proofing.
Implementation Method 1
The switch is configured to couple the power source to the heater when activated by the trigger signal which in turn causes the heater to generate heat sufficient to initiate self-destruction of the stressed substrate
Implementation Method 2
The sensor is configured to generate a trigger signal when exposed to a trigger stimulus
Data Source
AI summary
A self-destructing device includes a stressed substrate with a heater thermally coupled to the stressed substrate. The device includes a power source and trigger circuitry comprising a sensor and a switch. The sensor generates a trigger signal when exposed to a trigger stimulus. The switch couples the power source to the heater in response to the trigger signal When energized by the power source, the heater generates heat sufficient to initiate self-destruction of the stressed substrate.