Semi-Flex PCB Cover Opening Structure for Clean Glue Stripping
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Solution Overview
Problem
The existing manufacturing process for printed circuit boards with cover-opening openings faces issues such as difficulty in stripping off strippable glue, residue of glue affecting electrical characteristics, and prolonged cleaning times due to glue mixing with PP glue, leading to reliability concerns.
Innovation Solution
A semi-flex printed circuit board design featuring a core substrate with a cover-opening opening penetrating through two sides, metal dam structures surrounding the opening, a bonding sheet attached to the substrate, and laser cutting sidewalls with a specific included angle between 120 to 150 degrees, facilitating easier removal of strippable ink and reducing residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If strippable glue is used in the cover-opening operation, then the opening can be formed, but the glue mixes with PP glue making it difficult to strip off
Solution Approach 1:
The patent segments the sidewall structure into multiple portions with different inclinations. The first sidewall portion has a first inclination relative to the bottom surface, while the second sidewall portion has a second inclination that differs from the first. This segmentation allows different regions to serve different functions: one region facilitates glue stripping while another provides structural support, thereby resolving the contradiction between ease of manufacture and ease of stripping.
Solution Approach 2:
The patent applies local quality by giving different geometric characteristics to different parts of the sidewall. Specifically, the first sidewall portion is designed with a specific inclination angle optimized for glue removal, while the second sidewall portion has a different inclination optimized for structural integrity. This localized differentiation enables the structure to simultaneously achieve easy stripping in the first region while maintaining manufacturing feasibility in the second region.
2Productivity
If conventional laser cutting is used, then the cover-opening is formed, but residue glue remains affecting electrical characteristics
Solution Approach 1:
The patent implements preliminary action by pre-designing the sidewall geometry with specific inclination angles before the glue application and stripping processes. The first sidewall portion is预先 designed with an inclination that facilitates complete glue removal, preventing residue formation that would affect electrical characteristics. This preliminary structural design ensures that subsequent manufacturing steps can achieve complete stripping without compromising reliability.
Solution Approach 2:
The patent changes geometric parameters of the sidewall structure to resolve the contradiction. By adjusting the inclination angles of different sidewall portions, the patent optimizes the structure for both manufacturing efficiency and complete glue removal. The specific parameter changes in sidewall geometry enable the laser cutting process to achieve both high productivity and complete residue-free stripping, thereby maintaining electrical characteristics.
3Device complexity
If the sidewall angle is not optimized, then manufacturing is simpler, but glue stripping time increases
Solution Approach 1:
The patent introduces dynamic optimization by designing the sidewall structure with multiple portions having different inclinations. This dynamic geometric configuration allows the structure to adapt to different functional requirements: the first sidewall portion's inclination is optimized for rapid glue stripping, reducing time loss, while the second portion maintains structural stability. This dynamic design resolves the contradiction between structural complexity and stripping time by optimizing each portion's geometry for its specific function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the reliability of the printed circuit board by ensuring easy stripping of strippable ink and minimizing residue, thereby improving manufacturing efficiency and electrical performance.
Implementation Method 1
two sides of a bottom of the core substrate surrounding the cover-opening opening are provided with two laser cutting sidewalls respectively
Data Source
AI summary
A semi-flex printed circuit board with cover-opening opening is disclosed. An inner side of the core substrate surrounds a cover-opening opening. The two metal dam structures are arranged on a side surface of the core substrate; and the two metal dam structures and the core substrate jointly surround the cover-opening opening. The core board is arranged on a side surface of the bonding sheet away from the core substrate. Two sides of a bottom of the core substrate surrounding the cover-opening opening are provided with two laser cutting sidewalls respectively. Sidewalls of the two metal dam structures surrounding the cover-opening opening are connected with the two laser cutting sidewalls respectively and each defined as a metal dam sidewall. An obtuse angle presents between the metal dam sidewall and the laser cutting sidewall.