Semi-Flex PCB Cover Opening Layout for Clean Ink Stripping
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Solution Overview
Problem
The existing manufacturing process for circuit boards faces difficulties in stripping off strippable ink due to its mixing with prepreg at the cover-opening opening edge, leading to prolonged stripping times and potential ink residue, which affects electrical characteristics.
Innovation Solution
A method involving the formation of convex metal dam structures and concave laser cut grooves on the core substrate, with strippable ink filled in the grooves, followed by laminating a build-up board structure and forming blind routing openings to facilitate ink removal, and finally separating the cover-opening structure from the grooves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If strippable ink is printed at the cover-opening opening edge, then the printing area is formed, but the ink mixes with prepreg causing difficulty in stripping
Solution Approach 1:
The patent segments the cover-opening opening edge into distinct regions: a printing area surrounded by metal dam structures and separate laser cut grooves. This segmentation prevents ink from mixing with prepreg by creating physical barriers (metal dams) and controlled pathways (laser grooves), enabling easier ink stripping while maintaining the printing area.
Solution Approach 2:
The patent introduces laser cut grooves as intermediary structures between the printing area and the cover-opening opening edge. These grooves serve as mediators that control ink placement and prevent direct contact between strippable ink and prepreg, facilitating easier ink removal while preserving the printing function.
2Shape
If laser is used to affect the edge angle, then the cover-opening shape is formed, but medicine liquid exchanging problem occurs resulting in long stripping time
Solution Approach 1:
The patent applies preliminary action by pre-forming laser cut grooves at the cover-opening opening edge before the ink printing and stripping processes. These pre-formed grooves establish proper medicine liquid exchange pathways in advance, preventing the angle-related exchanging problems that would otherwise occur during the stripping process, thereby reducing stripping time.
3Adaptability or versatility
If strippable ink is printed at the cover-opening opening, then the printing function is achieved, but ink residue may remain affecting electrical characteristics
Solution Approach 1:
The patent applies local quality by creating distinct structural zones: metal dam structures that provide barriers, laser cut grooves that control ink placement, and a defined printing area. This localized structural differentiation ensures ink is confined to appropriate regions, preventing residue that would affect electrical characteristics while maintaining printing functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances ink stripping efficiency and reduces residue by preventing ink overflow and facilitating easier removal of strippable ink, thereby maintaining the electrical integrity of the circuit board.
Implementation Method 1
forming two convex metal dam structures and two concave laser cut grooves on a side surface of the core substrate
Data Source
AI summary
A method for manufacturing a semi-flex printed circuit board is provided, including: forming two convex metal dam structures and two concave laser cut grooves on a side surface of the core substrate; wherein inner sides of the two metal dam structures form a printing area at the side surface of the core substrate, and the positions of the two laser cut grooves correspond to the printing area; printing a strippable printing ink in the printing area on the core substrate; laminating a build-up board structure on the side surface of the core substrate; and forming two blind routing openings on another side surface of the core substrate, which correspond to the two laser cut grooves in position respectively; removing a cover-opening structure of the core substrate between the two blind routing openings, so as to form a cover-opening opening.