Semiconductor Package Embedded Acoustic Chamber Design
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Solution Overview
Problem
Conventional semiconductor package designs for speakers lack an integrated acoustic chamber, leading to unsatisfactory sound reflection and distortion of frequency response, while attempts to improve acoustic performance through external casing designs result in increased size and production costs.
Innovation Solution
A semiconductor package device with an embedded acoustic chamber within the encapsulation layer, connected to the MEMS device through a narrow opening, which absorbs reflected waves and reduces package size, utilizing a design where the opening's width is smaller than the chamber's width to enhance low-frequency resonance and acoustic performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an external casing design is used to improve acoustic performance, then sound reflection and frequency response are improved, but package size and production costs increase
Solution Approach 1:
The acoustic chamber is nested within the encapsulation layer of the semiconductor package, creating an integrated structure where the chamber is embedded inside the existing package components rather than adding an external casing. This nesting approach provides acoustic performance improvement while maintaining compact package size.
Solution Approach 2:
The invention merges the acoustic chamber function with the encapsulation layer by integrating the chamber directly into the package structure. The encapsulation layer simultaneously serves as both the protective封装 and the housing for the acoustic chamber, eliminating the need for separate external casing components.
2Reliability
If an external casing design is used to improve acoustic performance, then sound reflection and frequency response are improved, but production costs increase
Solution Approach 1:
The acoustic chamber is integrated into the encapsulation layer during the existing semiconductor packaging process, merging two functions (encapsulation and acoustic chamber housing) into a single structure. This eliminates the need for separate external casing components and reduces assembly steps, thereby lowering production costs.
Solution Approach 2:
The encapsulation layer serves multiple functions: it provides protective封装 for the semiconductor components and simultaneously houses the acoustic chamber for sound reflection and frequency response improvement. This multi-functionality reduces the number of separate components needed, simplifying manufacturing and reducing costs.
3Reliability
If the opening width is made smaller than the chamber width, then low-frequency resonance and acoustic performance are enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The invention specifies a particular parameter relationship where the opening width is made smaller than the chamber width. This parameter change creates a specific acoustic resonance condition that enhances low-frequency response. The encapsulation layer thickness and opening dimensions are controlled to achieve the desired acoustic performance while remaining compatible with standard manufacturing capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embedded acoustic chamber design improves acoustic performance by reducing sound wave reflection and distortion, while minimizing package size and production costs, effectively enhancing low-frequency resonance and overall sound quality.
Implementation Method 1
The chamber is configured to receive a sound wave from the MEMS device through the first opening
Implementation Method 2
a width of the first opening is smaller than a width of the chamber... enhance low-frequency resonance
Data Source
AI summary
A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, and an encapsulation layer. The substrate has a first surface, a second surface opposite to the first surface, and a first opening extending from the first surface to the second surface. The first electronic component is disposed on the first surface of the substrate. The encapsulation layer is formed on the second surface of the substrate. The encapsulation layer includes a chamber connected to the first opening, and a width of the first opening is smaller than a width of the chamber.