Semiconductor Device Adhesive Gap Formation for Ventilation
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Solution Overview
Problem
In semiconductor devices, such as solid-state image sensors, moisture ingress through the adhesive layer can lead to condensation and particle entry, affecting image quality, and existing ventilation methods either compromise stress resistance or moisture resistance.
Innovation Solution
A method involving the application of an adhesive in a frame shape around the chip mounting region, followed by a stress application step to locally form gaps between the adhesive and the device members, allowing for ventilation while maintaining structural integrity and preventing particle entry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a portion not coated with adhesive is locally provided in the adhesive portion between the package body and the glass plate to allow air circulation, then ventilation between internal and external spaces is achieved, but particles with size equal to or smaller than the gap (5 to 30 μm) may enter the internal space of the package
Solution Approach 1:
The invention applies local quality by creating a specific region (gap formation region) with different properties from the rest of the adhesive portion. In this local region, the adhesive is configured to be easily peelable or have lower bonding strength, allowing controlled ventilation while the rest of the adhesive maintains strong bonding to prevent particle entry. This resolves the contradiction by localizing the ventilation function to a specific area rather than compromising the entire adhesive interface.
Solution Approach 2:
The adhesive portion is segmented into different functional regions: a gap formation region that provides ventilation and a surrounding region that maintains strong bonding. This segmentation allows the adhesive to simultaneously perform both ventilation and particle prevention functions in different areas, resolving the contradiction between allowing air circulation and preventing particle entry.
2Strength
If the thickness of the adhesive is made small to improve stress resistance, then peeling resistance increases, but moisture resistance lowers and moisture can easily enter the package
Solution Approach 1:
The invention applies local quality by creating a specific region (gap formation region) with different properties from the rest of the adhesive portion. In this local region, the adhesive is configured to be easily peelable or have lower bonding strength, allowing controlled ventilation while the rest of the adhesive maintains strong bonding to prevent particle entry. This resolves the contradiction by localizing the ventilation function to a specific area rather than compromising the entire adhesive interface.
Solution Approach 2:
The adhesive portion is segmented into different functional regions: a gap formation region that provides ventilation and a surrounding region that maintains strong bonding. This segmentation allows the adhesive to simultaneously perform both ventilation and particle prevention functions in different areas, resolving the contradiction between allowing air circulation and preventing particle entry.
3Object-affected harmful factors
If the thickness of the adhesive is made large to improve moisture resistance, then moisture resistance increases, but stress resistance lowers and the adhesive becomes prone to peeling upon temperature change
Solution Approach 1:
The invention applies local quality by creating a specific region (gap formation region) with different properties from the rest of the adhesive portion. In this local region, the adhesive is configured to be easily peelable or have lower bonding strength, allowing controlled ventilation while the rest of the adhesive maintains strong bonding to prevent particle entry. This resolves the contradiction by localizing the ventilation function to a specific area rather than compromising the entire adhesive interface.
Solution Approach 2:
The adhesive portion is segmented into different functional regions: a gap formation region that provides ventilation and a surrounding region that maintains strong bonding. This segmentation allows the adhesive to simultaneously perform both ventilation and particle prevention functions in different areas, resolving the contradiction between allowing air circulation and preventing particle entry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses particle entry and moisture ingress, ensuring reliable operation by allowing controlled ventilation without compromising stress resistance or moisture resistance.
Implementation Method 1
an adhering step of adhering, to the second member, the peripheral region of the first member in a state that the semiconductor chip is mounted in the chip mounting region, using an adhesive
Implementation Method 2
a stress applying step of generating a stress between the first member and the second member, after the adhesive starts to cure in the adhering step, to locally form a gap in at least one of a portion between the first member and the adhesive, and a portion between the second member and the adhesive
Data Source
AI summary
A method of manufacturing a semiconductor device including a first member including a chip mounting region and a peripheral region, a semiconductor chip mounted in the chip mounting region, and a second member fixed to the first member to cover the semiconductor chip, includes adhering, to the second member, the peripheral region of the first member in a state that the semiconductor chip is mounted in the chip mounting region, using an adhesive, and generating a stress between the first member and the second member, after the adhesive starts to cure, to locally form a gap in at least one of a portion between the first member and the adhesive, and a portion between the second member and the adhesive.