Semiconductor Adhesive Composition and Film for Void, Bleed-Out Control
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Solution Overview
Problem
The challenge in semiconductor packaging is the occurrence of voids and bleed-out during the attachment of chips due to inadequate contact of the adhesive with the controller, leading to reduced communication speed and quality degradation.
Innovation Solution
An adhesive composition for semiconductors comprising a thermosetting resin, thermoplastic resin, curing agent, and nonionic surfactant, which improves surface tension and reduces wettability, thereby minimizing voids and bleed-out.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the adhesive is applied in the conventional manner for chip attachment, then the adhesive can be applied to the controller, but voids remain between the adhesive and the controller after pressure oven treatment
Solution Approach 1:
The patent modifies the adhesive composition by incorporating a nonionic surfactant, which changes the surface tension parameters of the adhesive. This parameter change enables the adhesive to spread more effectively and form better contact with the controller surface, eliminating voids without requiring changes to the application process or pressure oven treatment.
2Productivity
If the adhesive is applied to cover the controller for stacking chips, then package capacity increases, but adhesive bleed-out occurs at the chip edges
Solution Approach 1:
By adding a nonionic surfactant to the adhesive composition, the patent changes the surface tension and wetting properties of the adhesive. This parameter modification allows the adhesive to be applied in sufficient quantities to cover the controller for high-capacity packaging while preventing excessive spread and bleed-out at the chip edges during the attachment process.
3Reliability
If the adhesive composition is modified to reduce voids, then contact quality improves, but the composition complexity increases
Solution Approach 1:
The patent introduces a nonionic surfactant as an intermediary substance in the adhesive composition. This surfactant acts as a mediator between the adhesive and the controller surface, improving wetting and contact quality without requiring complex multi-component systems or sophisticated formulation approaches. The single additive component simplifies the overall composition while achieving the desired performance improvement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition effectively reduces voids and bleed-out, enhancing the reliability and quality of semiconductor packages by improving surface tension and wettability.
Implementation Method 1
An adhesive composition for a semiconductor according to an embodiment of the present invention may have improved surface tension by adding a nonionic surfactant
Data Source
AI summary
The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.