Non-Macromolecular Adhesive Additives TRIZ Cases

This silicone elastomer composition enables direct thermoplastic bonding and improves durability under heat and humidity without primers.

Intumescent layers separate composite substrates below degradation temperatures.

A composite epoxy curing system with a radical scavenger helps endoscope bonds retain strength during heat and ozone-water sterilization.

Nonionic surfactant improves semiconductor adhesive contact while reducing voids and bleed-out.

This epoxy composition holds strong in service, then loses adhesion when heated for simpler vehicle-part disassembly and recycling.

Crosslinked polymers, inorganic layers, and plasma treatment bridge organic crystals to solid workpieces for VR/AR optical integration.

A photocleavable compound releases an amine after UV exposure, extending work life beyond four weeks and enabling curing at 85°C or lower.

Crosslinked polyisobutene adhesives improve shear strength, creep resistance, and polar adhesion.

Lipophilic polymers attached to inorganic whiskers reduce aggregation, limiting light loss while widening chromaticity viewing angle.

Optimized antifoam addition and emulsion polymerization reduce bubbles during high-speed coating without sacrificing adhesive properties.

This case combines metallocene polyolefin, tackifier, and wax to maintain peel force while sealing thin films at 160°F or less.

A low-modulus porous adhesive film combines impact resistance, peel strength, and flexural reliability without extra adhesive layers.

This case combines polymers and waxes with controlled rheology to preserve adhesion on hydrophilic fibers exposed to water.

A silicone-resin adhesive balances thermal conductivity, strength, and curing speed.

This adhesive embeds oxide or salt particles in a thermoplastic matrix to bond varied surfaces strongly and support aqueous debonding.

This resin composition combines polyolefin, acid-modified resin, and platy filler for adhesion, water vapor barriers, and low-pressure flow.

This reactive adhesive tape preserves cured bond strength after storage, including in small die-cuts and elongated structures.

This reactive adhesive tape uses an electrolyte for voltage-triggered debonding while preserving bond strength and storage stability.

This hot-melt formulation combines elastomers, tackifiers, and dual-weight paraffin oils for stable bonding and easier component separation.

A solvent-based epoxy and silane primer with core-shell rubber supports uniform metal bonding, toughness, and corrosion protection.

Epoxy-acryl adhesive sheets combine rigidity and elongation to limit positional shifting and protect strain measurement accuracy.

A styrene/(meth)acrylate composite with glass-transition points 30°C apart supports pressure-induced bonding in printed matter.

Functional substituents help this adhesive bond strongly on wet and underwater surfaces.

Carboxylated, crosslinked latex and a selected surfactant improve initial adhesion and stability in chloroprene adhesive blends.

Polyol-anhydride adhesive limits bleeding and improves photochromic lens transitions.

This case uses elastomeric particles and externally activated guanidine curing to strengthen epoxy bonds across varied substrates.

A heat-meltable, non-fluid composition improves electrode-layer uniformity, viscoelasticity, adhesion, and storage stability.

This one-part polyurethane sealant balances low-temperature extrusion force, moisture curing, storage stability, and adhesion.

Polymeric dispersant stabilizes conductive filler for durable, defect-resistant displays.

A non-isotactic/isotactic butene-1 blend improves high-speed adhesive processing while limiting migration and preserving cohesion.

A stable methacrylic tackifier layer combines polymer and radical initiator to limit outgas and residues during lithography exposure.

Acrylate and alkenyl groups enable heat- or radiation-cured bonding of inert tubing to medical connectors.

A multilayer resist material combines fluorinated resin and thermal acid generation to support adhesion and precise pattern profiles.

A photo-initiated adhesive layer changes bonding after UV exposure, reducing residue and easing wafer tape peeling after dicing.

Water-removable adhesive chemistry balances durable bonding with protective film recyclability.

A polysiloxane foam with hollow ceramic particles and fire retardant supports compressible thermal barriers for lithium-ion batteries.

Metal grids embedded between TCO and transport layers reduce resistive losses while preserving transparent electrode function.

SMA, PAA, polyvinyl alcohol, starch, and a homogenizer support stable storage and quick, water-triggered insulation bonding.

This battery barrier combines silicone foam, hollow ceramics, and fire retardant to limit heat and flame propagation.

A non-halogen polyolefin film delivers flame retardancy without toxic emissions.

This grease combines conductive fillers, acrylic adhesive, and surface modifiers to stabilize heat dissipation during thermal cycling.

A water-based starch adhesive uses enzymatic modification and fatty acids for strong, dimensionally stable glue sticks.

Heat-activated bonding improves display adhesion while preserving low haze and light extraction.

This case combines functional monomers with an aluminum surface hardener to balance tack, shear resistance, and aged adhesion.

Hydrophilized thermoplastic polyurethane dispersion in polar-aprotic solvent and water reduces VOC emissions while maintaining adhesive strength.

Soluble conductivity promoters decompose to form nano-disperse metal domains, resolving performance variability caused by insoluble salt aggregation.

Optimized polyurethane resin ratio and polymerization inhibitor reduce toxic residual monomers in hot-melt adhesives below regulatory limits.

Acrylic adhesive layer with ammonium polyphosphate maintains tackiness at low temperatures.

Composite alumina particles with silica coatings resolve hygroscopicity trade-offs, improving water resistance and stability in electronic thermal management.

A thermosetting adhesive balances heat resistance and toughness using a composite resin system.