Silicone Resin Adhesive Composition for Thermal Conductivity and Fast Curing
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Solution Overview
Problem
Existing thermally conductive adhesives lack sufficient mechanical properties, thermal conductivity, and curing efficiency, particularly those without silicone resin components.
Innovation Solution
A composition comprising silane-crosslinking polymer, epoxy resin, epoxy resin curing agent, optional organosilicon compound without nitrogen-bonded carbonyl groups, filler, and silicone resin, with a weight ratio of silicone resin to silane-crosslinking polymer between 0.5 and 4, and a high filler content, enhancing thermal conductivity and adhesive strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If silicone resin component is removed from the composition, then the composition is free of silicone resin components, but the mechanical properties become poor
Solution Approach 1:
The patent combines multiple polymer components (polyester polymer, polyether polymer, polyurethane polymer) with silane-modified groups to create a composite adhesive system that achieves both silicone-free formulation and improved mechanical properties through synergistic interactions between components
Solution Approach 2:
The invention uses a composite material system consisting of multiple polymer types with silane modifications, combined with specific filler materials (alumina, aluminum hydroxide, silica) to create an adhesive composition that provides both mechanical strength and thermal conductivity without relying on silicone resin
2Temperature
If filler content is increased to improve thermal conductivity, then thermal conductivity improves, but viscosity increases and operability deteriorates
Solution Approach 1:
The patent optimizes the particle size distribution of fillers (combining fine particles <10μm with coarse particles 10-50μm) and controls the total filler content within 40-80 parts by weight per 100 parts of polymer composition to achieve high thermal conductivity while maintaining acceptable viscosity and operability
Solution Approach 2:
The invention uses a bimodal particle size distribution of fillers where fine particles fill gaps between coarse particles, creating a optimized packing structure that maximizes thermal conductivity while minimizing the impact on viscosity and maintaining operability
3Temperature
If curing temperature is reduced to achieve low curing temperature, then curing temperature decreases, but curing speed becomes slow
Solution Approach 1:
The patent employs a self-crosslinking mechanism where silane-modified polymer groups react with atmospheric moisture to form crosslinked structures, enabling the adhesive to cure at room temperature without external heat input while maintaining practical curing speeds through the inherent reactivity of the silane groups
Solution Approach 2:
The invention uses silane-modified polymer groups as intermediaries that facilitate crosslinking reactions at low temperatures by reacting with moisture from the air or substrates, acting as a bridge between the adhesive components and enabling curing without high temperature input
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high thermal conductivity, strong adhesive force, fast curing speed, and low curing temperature, with improved mechanical properties and operational performance.
Implementation Method 1
Component (A) silane-crosslinking polymer
Implementation Method 2
Component (B1) epoxy resin, Component (B2) epoxy resin curing agent
Implementation Method 3
component (D) filler, high filler content, enhancing thermal conductivity
Implementation Method 4
Component (E) silicone resin, strong adhesive force
Data Source
AI summary
Compositions (M), methods for making and uses for the same. Where the composition (M) includes a component (A) of silane-crosslinking polymer, a component (B1) of an epoxy resin, a component (B2) of an epoxy resin curing agent, an optional component (C) of an organosilicon compound that does not nitrogen atoms bonded directly to carbonyl groups, a component (D) filler, and a component (E) of a silicone resin. Where the weight ratio of the component (E) to the component (A) is greater than or equal to 0.5, preferably between 0.55-5, more preferably between 0.6-4.