In-situ Semiconductor Aging Sensors

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Solution Overview

Problem

Existing methods fail to accurately model the aging process of semiconductors and their functional blocks, leading to inadequate prediction of device reliability and premature failures due to limited lifespan and sensitivity to process variations.

Innovation Solution

In-situ positioning of reliability sensors within each functional block and critical locations of a semiconductor system, optimized for maximum sensitivity, which models the aging process and comprises a network of stages with self-digitization capabilities, allowing for operational and measurement modes to track the aging process in real-time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If in-situ reliability sensors are positioned within each functional block and critical locations, then measurement precision of semiconductor aging is improved, but device complexity increases

Engineering Contradiction:
Improveaging measurement precisionVSAvoidsensor network complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The semiconductor system is divided into multiple functional blocks, each equipped with its own in-situ reliability sensor. This segmentation allows localized aging measurement in each block, improving overall measurement precision while distributing the complexity across modular units rather than requiring a centralized complex system

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each functional block contains self-contained reliability sensors that autonomously model and measure aging in their respective locations. The sensors operate independently using local circuit switching behaviors and system operation patterns, eliminating the need for external control infrastructure and reducing overall system complexity

Inventive Principle:
Principle #25Self-service

2Reliability

If sensors model the aging process through operational modes subject to aging, then reliability prediction accuracy is improved, but loss of time for measurement increases

Engineering Contradiction:
Improvereliability prediction accuracyVSAvoidmeasurement time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The reliability sensors operate continuously in operational modes that mirror actual system usage patterns. By maintaining continuous aging exposure during normal operation rather than requiring separate test periods, the system achieves accurate reliability predictions without sacrificing productive time

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

The sensors are pre-configured with mode selection inputs and operational trigger inputs that enable them to automatically transition between operational and measurement modes. This preliminary setup allows the sensors to begin aging modeling immediately upon system deployment, eliminating setup time and enabling immediate reliability assessment

Inventive Principle:
Principle #10Preliminary action

3Measurement precision

If sensors are optimized for maximum sensitivity to known process variations, then measurement precision is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improvesensor sensitivityVSAvoidsensor fabrication precision
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The sensors are designed to detect changes in operational parameters (such as frequency, timing, or voltage) that naturally occur during semiconductor aging. By monitoring these inherent parameter variations rather than requiring extreme physical precision in sensor fabrication, the system achieves high measurement sensitivity with standard manufacturing capabilities

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The reliability sensors are designed to copy or mirror the operational characteristics of the functional blocks they monitor. This copying approach allows the sensors to naturally adapt to process variations without requiring ultra-precise matching, as they simply replicate the same circuit switching behaviors and operation patterns that define the system's aging characteristics

Inventive Principle:
Principle #26Copying

Data Source

PatentUS8935143B2Semiconductor sensor reliability
Publication Date: 2015.01.13 SDEP CORP
  • US8935143B2 patent drawing
  • US8935143B2 patent drawing
  • US8935143B2 patent drawing

AI summary

Embodiments of the present invention provide a semiconductor sensor reliability system and method. Specifically, the present invention provides in-situ positioning of a reliability sensor (hereinafter sensors) within each functional block, as well as at critical locations, of a semiconductor system. The quantity and location of the sensors are optimized to have maximum sensitivity to known process variations. In general, the sensor models a behavior (e.g., aging process) of the location (e.g., functional block) in which it is positioned and comprises a plurality of stages connected as a network and a self-digitizer. Each sensor has a mode selection input for selecting a mode thereof and an operational trigger input for enabling the sensor to model the behavior. The model selection input and operation trigger enable the sensor to have an operational mode in which the plurality of sensors are subject to an aging process, as well as a measurement mode in which an age of the plurality of sensors is outputted.