Semiconductor Unit Alignment Groove Design for Trapped Substance Removal

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Solution Overview

Problem

The occurrence of failures in semiconductor units due to alignment grooves, specifically caused by substances being trapped during the production process, which can lead to cracks and other defects.

Innovation Solution

Incorporating a second groove in communication with the alignment groove, allowing substances to move out and reducing the likelihood of trapping, thereby preventing failures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If an alignment groove is provided in the semiconductor substrate for position adjustment, then alignment accuracy is improved, but substances can be trapped in the groove causing failures

Engineering Contradiction:

Improvealignment accuracyVSAvoidfailure occurrence

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The patent extracts the harmful trapped substances from the alignment groove by providing a discharge groove that communicates with the alignment groove, allowing substances to be removed from the confined space of the alignment groove to prevent failures

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The discharge groove acts as an intermediary structure that provides a communication path between the alignment groove and the external environment, enabling substances to escape without affecting the alignment function

Inventive Principle:

Principle #24Intermediary (Mediator)

2Measurement precision

If the alignment groove is closed in the production process, then alignment function is maintained, but substances become trapped causing failures

Engineering Contradiction:

Improvealignment functionVSAvoidsubstance trapping

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The patent extracts trapped substances from the closed alignment groove through the discharge groove, allowing the alignment groove to remain closed for maintaining alignment function while preventing substance accumulation

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent adds a new dimensional aspect by introducing a second groove (discharge groove) that communicates with the first groove (alignment groove), creating a three-dimensional substance escape path while maintaining the two-dimensional alignment function

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If substances are trapped in the alignment groove, then pressure builds up causing cracks, but providing a discharge path may affect alignment accuracy

Engineering Contradiction:

Improvefailure preventionVSAvoidalignment accuracy

Core Design Contradiction:

ReliabilityVSMeasurement precision

Solution Approach 1:

The patent segments the groove structure into two distinct functional parts: the alignment groove for position adjustment and the discharge groove for substance removal, allowing each to perform its specific function independently without interfering with alignment accuracy

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS11515349B2Semiconductor unit

Publication Date: 2022.11.29 SONY SEMICON SOLUTIONS CORP

AI summary

A semiconductor unit includes: a semiconductor substrate; a first groove provided in the semiconductor substrate, having a first width W1 and extending in a first direction; and a second groove provided in the semiconductor substrate in communication with the first groove, having a second width W2 different from the first width, and extending in a second direction that intersects the first direction, in which one of the first groove and the second groove is used for alignment.