Semiconductor Package Anti-Oxidation RDL Structure
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Solution Overview
Problem
Oxidation can adversely affect the performance of semiconductor device packages, particularly by increasing contact resistance and slowing down signal transmission.
Innovation Solution
The semiconductor device package includes a redistribution layer (RDL) structure, conductive pillars, and an anti-oxidation structure to prevent oxidation, ensuring efficient electrical connections and fast signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive terminals are exposed without protection, then electrical connection is achieved, but oxidation increases contact resistance and degrades performance
Solution Approach 1:
The patent applies preliminary anti-action by forming an anti-oxidation structure on the conductive terminals before oxidation can occur. This protective layer is deposited in advance to prevent the harmful oxidation reaction, thereby maintaining low contact resistance and reliable electrical connections throughout the device's operational life.
Solution Approach 2:
The anti-oxidation structure serves as an intermediary between the conductive terminal and the oxidizing environment. This intermediate layer protects the conductive terminal from direct contact with oxygen, preventing oxidation while still allowing the underlying terminal to maintain its electrical function.
2Reliability
If anti-oxidation structure is added to protect conductive terminals, then oxidation resistance is improved, but device complexity increases
Solution Approach 1:
The anti-oxidation structure is applied selectively only to the conductive terminals that require protection, rather than coating the entire device. This localized approach provides necessary oxidation resistance at critical interfaces while minimizing the addition of overall device complexity and material usage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively mitigates oxidation-related performance issues by maintaining low contact resistance and ensuring rapid data transmission within the semiconductor device package.
Implementation Method 1
oxidation may adversely affect performance of the semiconductor device package
Data Source
AI summary
A semiconductor device package includes a first semiconductor device, a first redistribution layer (RDL) structure and a second RDL structure. The first semiconductor device has a first conductive terminal and a second conductive terminal. The first RDL structure covers the first conductive terminal. The second RDL structure covers the second conductive terminal and being separated from the first RDL structure.