Optoelectronic Semiconductor Array Assembly for Tilt-Free Light Output
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Solution Overview
Problem
The assembly of optoelectronic semiconductor components with small lateral extents is challenging due to high placement accuracy requirements and the difficulty in achieving uniform radiation behavior without tilt during mounting.
Innovation Solution
The arrangement involves mounting semiconductor components with radiation outlet sides free of contacts on a carrier, followed by electrical contacting through connection structures, allowing for simplified assembly and reduced tilt during mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If semiconductor components with small lateral extents are assembled, then the area occupied is reduced and integration density is improved, but the placement accuracy requirement increases and assembly difficulty worsens
Solution Approach 1:
The patent divides the semiconductor component into two separate parts: the light-emitting semiconductor chip and the carrier. The carrier acts as an intermediate segment that simplifies handling and placement. By segmenting the component, the small lateral extent of the chip is maintained for high density, while the carrier provides a larger, easier-to-manipulate structure for assembly processes.
Solution Approach 2:
The carrier serves as an intermediary element between the semiconductor chip and the final mounting position. It facilitates the assembly process by providing a stable platform for chip attachment, enabling accurate positioning without requiring direct high-precision placement of the small chip itself. The carrier mediates between the chip's small dimensions and the assembly system's capabilities.
2Ease of manufacture
If semiconductor components are mounted on a carrier, then the ease of assembly is improved and tilt is reduced, but the device complexity increases due to additional components
Solution Approach 1:
The patent merges the semiconductor chip with the carrier to form an integrated assembly unit. This combination simplifies the overall manufacturing process by treating the chip-carrier pair as a single manageable entity during assembly and testing. The merged structure can be handled, positioned, and installed as one unit, reducing assembly steps despite the added carrier component.
Solution Approach 2:
The carrier performs multiple functions: it provides mechanical support for the semiconductor chip, facilitates precise positioning during assembly, enables electrical connections, and allows for easy mounting and dismounting. This multi-functionality justifies the added complexity by consolidating several requirements into a single component that simplifies the overall system.
3Illumination intensity
If contact structures are arranged on the rear face of semiconductor bodies, then the radiation outlet side is freed from contacts improving radiation coupling, but the electrical connection complexity increases
Solution Approach 1:
The patent inverts the conventional arrangement by placing contact structures on the rear face of the semiconductor chip instead of on the light-emitting surface. This inversion allows the radiation outlet side to remain completely free of contacts, maximizing light extraction efficiency. The electrical connections are routed through the carrier to reach the rear-face contacts, maintaining functionality while optimizing optical performance.
4Reliability
If insulation layers are arranged between adjacent semiconductor components, then the electrical insulation is improved preventing short circuits, but the manufacturing precision requirement increases for layer placement
Solution Approach 1:
The insulation layer is applied to the carrier before the semiconductor chip is mounted. This preliminary action ensures that the insulation is already in place and properly positioned before the chip attachment process begins. By performing the insulation application in advance, the precision requirements during the final chip mounting step are reduced, as the insulation layer is already fixed and aligned.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient and accurate assembly of optoelectronic semiconductor components with small lateral extents, ensuring uniform radiation behavior and improved contrast between adjacent components.
Implementation Method 1
The optoelectronic semiconductor components each comprise a semiconductor body, with an active region arranged to emit electromagnetic radiation... The active region preferably comprises a pn junction, a double heterostructure, a single quantum well (SQW) structure, or a multi-quantum well (MQW) structure for radiation generation.
Implementation Method 2
The insulation layer is designed to be absorbing or reflecting for radiation generated in the active region. In particular, the insulation layer is designed to be absorbent or reflective for visible electromagnetic radiation... the insulation layer primarily absorbs radiation in the blue and green spectral ranges and thus evokes a red color impression for an observer.
Data Source
AI summary
In an embodiment an arrangement includes a plurality of optoelectronic semiconductor components arranged in a common plane, wherein each semiconductor component is laterally delimited by side faces, and wherein each semiconductor component includes a semiconductor body having an active region configured to emit electromagnetic radiation, a radiation outlet side configured to couple out the electromagnetic radiation, a rear face opposite to the radiation outlet side, and a contact structure arranged on the rear face, an output element, an electrically insulating insulation layer and an electrical connection structure, wherein the insulation layer is arranged between side faces of adjacent semiconductor components, wherein the output element is arranged at the radiation outlet sides of the semiconductor components, wherein the electrical connection structure is electrically conductively connected with the contact structure, and wherein the connection structure includes an adhesive layer, a growth layer and a connection layer.