Semiconductor Array Bridging Portion for Substrate Separation
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Solution Overview
Problem
Conventional methods for producing micro LED devices face challenges in efficiently separating semiconductor layers from growth substrates, with the first method resulting in large LED devices and the second method risking damage to the semiconductor layer during substrate peeling.
Innovation Solution
A semiconductor array design featuring a bridging portion with leg and top portions, through holes, and voids that allows for easy separation of the substrate from the semiconductor laminates by breaking the leg portion, while maintaining good crystallinity and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the growth substrate is attached to the semiconductor layer (first method), then the substrate provides mechanical support and stability, but the LED device becomes large and the separation process is complex
Solution Approach 1:
The patent divides the semiconductor structure into distinct segments: the growth substrate, the bridging portion with leg and top sections, and the semiconductor laminate. This segmentation allows the substrate to provide mechanical support during growth while enabling clean separation afterward, resolving the contradiction between needing substrate support and achieving compact device size.
Solution Approach 2:
The patent extracts the substrate attachment function to a specific bridging portion structure that can be selectively removed. The leg portion of the bridge is designed to break during separation, allowing the substrate to be taken out from the final device structure, thus achieving compact LED size while maintaining substrate support during manufacturing.
2Length of moving object
If the substrate is peeled off from the divided semiconductor layer (second method), then the device size can be reduced, but the substrate is not easily separated without damaging the semiconductor
Solution Approach 1:
The patent introduces a bridging portion as an intermediary structure between the substrate and semiconductor laminate. This bridge with its leg portion acts as a sacrificial element that facilitates safe separation - it provides a controlled path for substrate removal while protecting the semiconductor laminate from damage during the peeling process.
Solution Approach 2:
The bridging portion structure is prepared in advance during the growth process, with the leg portion specifically designed to be the weak link. This preliminary arrangement ensures that when separation is needed, the substrate can be cleanly removed without damaging the semiconductor, as the bridge has already been positioned to guide the separation process.
3Ease of manufacture
If through holes are formed in the bridging portion, then voids are created to facilitate separation and reduce dislocation transfer, but the structural integrity of the bridging portion is reduced
Solution Approach 1:
The patent applies local quality by forming through holes specifically in the leg portion of the bridging structure rather than uniformly throughout. This localized modification creates voids that facilitate separation and block dislocation paths where needed, while preserving the structural integrity of the top portion that supports the semiconductor laminate.
Data Source
AI summary
There are provided a semiconductor array and a method for producing a micro device, in which the semiconductor laminate used in the micro device can be readily separated from the substrate. The semiconductor array includes a substrate, a bridging portion bridged to the substrate, a plurality of semiconductor laminates arranged on the bridging portion, and first voids defined by the substrate and the bridging portion. The bridging portion has a plurality of through holes formed at least one of the leg portion and the top portion. The first void communicates with the outside of the semiconductor array via the through holes. Each of the semiconductor laminates is in direct contact with each of the top portions.