Semiconductor Structure Assembly Isolation Region Component Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In wafer-level packaging technology, the peripheral region of substrates is overcrowded with electronic components, limiting the ability to add more components, which is a challenge in achieving miniaturization and increased functionality in electronic devices.
Innovation Solution
The solution involves rerouting and extending current conducting traces from the circuit and seal ring regions into the assembly isolation region to form additional electric components, such as capacitors or inductors, thereby increasing the number of components that can be integrated at the peripheral substrate region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional packaging technology is used, then the substrate has sufficient space for components, but the number of components per wafer and functionality are limited
Solution Approach 1:
The patent extends conductive traces from the circuit region and seal ring region into the assembly isolation region, utilizing the previously unused peripheral space. This dimensional extension allows components to be formed in the assembly isolation region, effectively increasing the component density without requiring additional substrate area.
Solution Approach 2:
The substrate is divided into distinct regions: circuit region, seal ring region, and assembly isolation region. By segmenting the substrate and identifying the assembly isolation region as a separate functional area, the patent enables component formation in this previously underutilized space, thereby increasing overall component capacity.
2Productivity
If wafer level packaging technology is used to increase component density, then miniaturization is achieved, but the peripheral region becomes overcrowded with components
Solution Approach 1:
The patent utilizes the assembly isolation region, which is located between the circuit region and seal ring region, to form additional components. This effectively adds a new dimensional space for component placement, reducing the overcrowding in traditional peripheral areas while maintaining high component density.
Solution Approach 2:
The assembly isolation region, which traditionally served only as an isolation area, is repurposed to also function as a component formation region. This multi-functional utilization of space allows the substrate to accommodate more components without increasing overall complexity.
3Adaptability or versatility
If more components are added to the peripheral region, then functionality increases, but manufacturing precision and reliability decrease
Solution Approach 1:
By extending traces into the assembly isolation region, the patent creates additional component formation space that is spatially separated from the crowded circuit region. This dimensional separation maintains manufacturing precision by providing adequate space for trace routing and component formation without compromising placement accuracy.
Solution Approach 2:
The patent applies different functional qualities to different regions: the circuit region for active circuitry, the seal ring region for sealing, and the assembly isolation region for additional components. This local differentiation allows each region to be optimized for its specific function, maintaining high manufacturing precision in each area while collectively increasing overall functionality.
Data Source
AI summary
The present disclosure provides a semiconductor structure. The semiconductor structure includes a circuit region, a seal ring region and an assembly isolation region. The circuit region includes a first conductive layer. The seal ring region includes a second conductive layer. The assembly isolation region is between the circuit region and the seal ring region. The first conductive layer and the second conductive layer respectively include a portion extending into the assembly isolation region thereby forming an electric component in the assembly isolation region.