Semiconductor Package Asymmetric Connecting Element
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Solution Overview
Problem
Conventional semiconductor devices face challenges in reliably connecting control electrodes to lead terminals due to the smaller size of control electrodes, leading to potential connection failures and reduced reliability.
Innovation Solution
A semiconductor device design featuring a seal portion with a first lead terminal, a second lead terminal, a first connecting element with a protruding end for the control electrode, and a conductive bonding agent to ensure stable connections, where the connecting element's width and orientation prevent falling and enhance stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the control electrode is connected to the lead terminal using a connecting element, then electrical connection is achieved, but the connecting element may fall down or push down other connecting elements due to the small size of the control electrode
Solution Approach 1:
The connecting element is designed with an asymmetric structure where one end has a smaller cross-sectional area to fit the control electrode and the other end has a larger cross-sectional area for stable support on the lead terminal. This asymmetric design prevents the connecting element from falling down or pushing down other connecting elements while maintaining reliable electrical connection.
2Stability of the object's composition
If the control electrode is made larger to improve connecting element stability, then position stability improves, but the control electrode size increases beyond design requirements
Solution Approach 1:
The connection structure is segmented into three distinct parts: the control electrode (small size), the connecting element (asymmetric structure), and the lead terminal (larger size). This segmentation allows each component to maintain its optimal size - the control electrode remains small while the connecting element's asymmetric design provides the necessary stability at the lead terminal interface.
3Ease of manufacture
If the connecting element is designed with uniform width, then manufacturing is simplified, but the connecting element cannot be stably connected to the smaller control electrode
Solution Approach 1:
The connecting element is designed with non-uniform cross-sectional dimensions, where one end has a smaller area matching the control electrode and the other end has a larger area for stable support. This local variation in geometry ensures reliable connection at both interfaces while remaining manufacturable through standard forming processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents connection failures of connecting elements, thereby improving the reliability of semiconductor devices by ensuring secure and stable connections between control electrodes and lead terminals.
Implementation Method 1
a first conductive bonding agent for joining together the control electrode of the electronic element and the one end of the first connecting element in a conductive manner
Implementation Method 2
a second conductive bonding agent for joining together the other end of the first connecting element and the one end of the second lead terminal
Data Source
AI summary
A semiconductor device is provided, including a seal portion; an electronic element within the seal portion; first, second, and third lead terminals; first and second connecting elements; and first and second conductive bonding agents, one end of the first connecting element having a protrusion downward and electrically connected to a control electrode of the electronic element with the first conductive bonding agent, a first side surface extending from the one end to the other end of the first connecting element is parallel to an extending direction along which the one end of the second connecting element extends, a wall portion being disposed on a top surface of the one end of the second lead terminal, and the wall portion being in contact with the other end of the first connecting element.