Semiconductor Package Barrier Structure for Passive Device Isolation
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Solution Overview
Problem
The increasing size of semiconductor packages leads to a reduced space between passive devices and adhesive materials, risking contact and potential electrical or functional failure due to adhesive bleeding and tin whisker growth.
Innovation Solution
Incorporation of a barrier structure that separates passive devices from the lid structure and adhesive material, preventing adhesive spreading and mitigating tin whisker growth, thereby protecting the passive devices from electrical failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the semiconductor package size is increased, then the semiconductor device can accommodate more components and higher functionality, but the space between passive devices and adhesive materials is reduced, increasing the risk of contact and electrical failure
Solution Approach 1:
The patent introduces a barrier structure that segments the package cavity into distinct regions: one containing the passive device and another containing the adhesive material. This segmentation prevents direct contact between the adhesive and passive device terminals, resolving the reliability issue while allowing continued package size expansion for enhanced functionality.
Solution Approach 2:
The barrier structure acts as an intermediary element between the passive device and the adhesive material. It provides physical separation and prevents harmful interactions (adhesive bleeding, tin whisker contact) while allowing both components to coexist in the same package, thus enabling larger package sizes without compromising electrical reliability.
2Area of stationary object
If the space between passive devices and adhesive materials is reduced, then the package size can be minimized, but adhesive bleeding and tin whisker growth may cause contact and electrical failure
Solution Approach 1:
The barrier structure serves as a protective intermediary that allows minimal spacing between passive devices and adhesive materials without risking contact. It blocks adhesive bleeding and prevents tin whiskers from reaching the lid structure, enabling compact package design while mitigating harmful effects.
Solution Approach 2:
The barrier structure is positioned in advance to prevent harmful actions before they can occur. By blocking the potential paths of adhesive bleeding and tin whisker growth, it preemptively counteracts these harmful effects, allowing reduced spacing without increasing failure risk.
3Reliability
If a barrier structure is introduced to separate passive devices from adhesive materials, then reliability is improved by preventing contact, but device complexity increases
Solution Approach 1:
The barrier structure is implemented as a thin film or shell that lines the package cavity. This approach provides effective separation and protection against adhesive bleeding and tin whisker growth while occupying minimal space and adding relatively little structural complexity compared to bulkier protective mechanisms.
Data Source
AI summary
A device including a semiconductor package, a first passive device, a first barrier structure and a lid structure. The semiconductor package is disposed on a substrate. The first passive device is disposed on the substrate aside the semiconductor package. The first barrier structure is laterally surrounding the first passive device. The lid structure is disposed on the substrate. The first barrier structure is formed with a first sidewall located in between a sidewall of the semiconductor package and a first side surface of the first passive device, and formed with a second sidewall located in between a sidewall of the lid structure and a second side surface of the first passive device. The lengths of the first and second sidewalls are formed to be smaller than a length of the sidewall of the semiconductor package, and greater than a length of the first side surface.