Semiconductor Clip With Bent Support For Moisture Path Extension
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Solution Overview
Problem
The existing manufacturing technologies for semiconductor devices using clip frames, while improving assembly workability, face reliability issues due to moisture infiltration paths formed during the cutting of sealing bodies, which can lead to degradation and leakage currents.
Innovation Solution
The semiconductor device incorporates a clip with a plate-like portion and support portions that have bent ends, extending along the side surfaces of the sealing body, increasing the moisture path length and reducing the likelihood of moisture reaching the semiconductor chip, thereby enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If clips are collectively mounted over a plurality of semiconductor chips by using a clip frame, then assembly workability is improved, but moisture infiltration paths are formed during cutting of sealing bodies leading to reliability degradation
Solution Approach 1:
The support lead is formed with a bent portion instead of a straight configuration. This curvature increases the path length that moisture must travel to reach the semiconductor chip from the exposed end of the support lead, thereby reducing moisture infiltration risk while maintaining the collective mounting advantage of the clip frame structure
Solution Approach 2:
The bent portion extends the support lead path in a different spatial dimension, creating a longer moisture path without increasing the linear distance or compromising the compact packaging structure. This dimensional approach allows the moisture path length to be increased independently of the device footprint
2Productivity
If suspension leads are cut during the cutting of sealing bodies, then individual semiconductor devices are produced, but exposed ends of suspension leads create moisture infiltration paths
Solution Approach 1:
The bent portion in the support lead creates a curved path that moisture must follow, significantly extending the infiltration path length compared to a straight lead configuration. This curvature effect is particularly effective at the exposed end where moisture would normally directly access the semiconductor chip
Solution Approach 2:
The exposed end of the support lead, which initially appears to be a harmful feature creating moisture infiltration paths, is transformed into a beneficial feature by forming a bent portion. This bent configuration uses the exposed end to create a longer moisture path, converting the potential harm into a protective feature that actively resists moisture infiltration
Data Source
AI summary
A semiconductor device includes a first chip mounting portion, a first semiconductor chip arranged over the first chip mounting portion, a first pad formed in a surface of the first semiconductor chip, a first lead which serves as an external coupling terminal, a first conductive member which electrically couples the first pad and the first lead, and a sealing body which seals a part of the first chip mounting portion, the first semiconductor chip, a part of the first lead, and the first conductive member. The first conductive member includes a first plate-like portion, and a first support portion formed integrally with the first plate-like portion. An end of the first support portion is exposed from the sealing body, and the first support portion is formed with a first bent portion.