Semiconductor Biasing Network for Polarization Homogeneity

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Solution Overview

Problem

Optoelectronic semiconductor components face challenges in achieving homogeneous polarization of structures due to inhomogeneous electromagnetic environments, leading to increased leakage current and reduced radiation absorption or emission efficiency, particularly in components with semiconductors like mercury-cadmium telluride that have low forbidden band energy.

Innovation Solution

A semiconductor component design featuring a conductive layer in contact with an insulating layer, which extends along the semiconductor layer and includes passages for individual biasing of each structure, allowing for uniform polarization and reflection of electromagnetic radiation, thereby reducing leakage current and enhancing radiation absorption or emission efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single peripheral bias contact is used to bias the semiconductor layer, then the device complexity is reduced, but the polarization homogeneity of the semiconductor layer deteriorates

Engineering Contradiction:
Improvebiasing network complexityVSAvoidpolarization homogeneity
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The single peripheral bias contact is segmented into multiple local bias contacts distributed across the semiconductor layer. Each local bias contact independently biases a specific region, ensuring homogeneous polarization without requiring a complex network of conductive tracks and close contacts.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The biasing approach transitions from a single-point peripheral contact to a distributed array of local contacts across the semiconductor layer surface. This spatial distribution in multiple dimensions achieves uniform polarization while simplifying the overall biasing network architecture.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If conductive tracks and close contacts are used to ensure homogeneous polarization, then the polarization homogeneity is improved, but the electromagnetic environment uniformity of the structures deteriorates

Engineering Contradiction:
Improvepolarization homogeneityVSAvoidelectromagnetic environment uniformity
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The harmful conductive tracks and close contacts that create inhomogeneous electromagnetic environments are extracted and removed from the device architecture. Homogeneous polarization is achieved through local bias contacts that directly contact the semiconductor layer without introducing interfering conductive elements between the structures.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The local bias contacts serve as intermediaries that provide the necessary bias voltage to the semiconductor layer without creating the electromagnetic interference problems associated with conductive tracks. These contacts enable polarization homogeneity while maintaining electromagnetic environment uniformity.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If the semiconductor layer is made sufficiently conductive to ensure homogeneous polarization, then the polarization homogeneity is improved, but the adaptability to low forbidden band energy semiconductors deteriorates

Engineering Contradiction:
Improvepolarization homogeneityVSAvoidcompatibility with low forbidden band energy semiconductors
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

Instead of requiring the entire semiconductor layer to have high conductivity, local bias contacts provide targeted biasing to specific regions. This local approach achieves homogeneous polarization without needing high overall conductivity, enabling compatibility with low forbidden band energy semiconductors like mercury-cadmium telluride.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The biasing strategy changes from relying on high semiconductor layer conductivity to using distributed local bias contacts. This parameter change in the biasing approach enables homogeneous polarization in materials with low forbidden band energy that cannot support high doping levels.

Inventive Principle:
Principle #35Parameter changes

4Ease of operation

If connection pads are used to bias the semiconductor zones, then the individual polarization capability is improved, but the leakage current increases due to insulator charging

Engineering Contradiction:
Improveindividual polarization capabilityVSAvoidleakage current
Core Design Contradiction:
Ease of operationVSObject-generated harmful factors

Solution Approach 1:

Local bias contacts serve as intermediaries between the connection pads and the semiconductor layer, providing the bias voltage without allowing direct contact that would charge the insulator. This intermediary approach maintains individual polarization capability while preventing leakage current generation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The direct connection between connection pads and semiconductor zones that causes insulator charging is extracted and replaced with local bias contacts. This removal of the harmful direct connection path eliminates the leakage current mechanism while preserving individual polarization functionality.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design ensures each structure operates in a consistent electromagnetic environment, reducing leakage current and improving radiation absorption or emission efficiency by reflecting non-absorbed radiation back into the component, resulting in more homogeneous performance across all structures.

Implementation Method 1

improving radiation absorption or emission efficiency by reflecting non-absorbed radiation back into the component

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentEP2885816B1Semiconductor component and process for fabricating a semiconductor component
Publication Date: 2021.03.10 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
  • EP2885816B1 patent drawingFigure 1~2
  • EP2885816B1 patent drawingFigure 3~4
  • EP2885816B1 patent drawingFigure 5~6b

AI summary

Semiconductor component (2) comprising a semiconductor layer (210) of a first conductivity type in which are arranged a plurality of semiconductor zones (220) of the opposite conductivity type to that of the semiconductor layer (210), and an insulating layer (271). The component furthermore comprising a first biasing means adapted to bias the semiconductor layer (210), and second biasing means each of which is adapted to bias one semiconductor zone (220). The first biasing means comprises a conductive layer (231) making contact with the insulating layer (271) and which comprises passages for each of the second biasing means with spacing between the conductive layer (231) and each of said second biasing means which is located facing the corresponding semiconductor zone (220).