Semiconductor Heat Dissipation Block Height Alignment in Packaging
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Solution Overview
Problem
Conventional methods for manufacturing semiconductor apparatuses face challenges in precisely uniforming the heights of heat dissipation blocks due to dimensional tolerances, leading to potential device damage or reduced heat dissipation properties.
Innovation Solution
A method involving the application of first and second adhesives with heat dissipation and thermosetting properties, where the second adhesive is applied higher than the resin height, and aligned through heat treatment to match the package height, ensuring uniform exposure of heat dissipation blocks without damaging devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the height of heat dissipation block is adjusted to expose it on module surface, then heat dissipation property is improved, but manufacturing precision deteriorates due to dimensional tolerance variations
Solution Approach 1:
A height adjustment layer (adhesive layer) is introduced as an intermediary between the heat dissipation block and the device. This layer compensates for dimensional tolerance variations in the heat dissipation blocks, enabling precise height adjustment to ensure uniform exposure on the module surface while maintaining good heat dissipation contact.
Solution Approach 2:
The thickness of the adhesive layer is controlled within a specific range (5-20 μm) to adjust the height of the heat dissipation block. By changing this parameter, the invention achieves precise height uniformity across multiple heat dissipation blocks despite variations in their manufacturing tolerances.
2Manufacturing precision
If heat dissipation block height is higher than expected, then exposure on module surface is improved, but device reliability deteriorates due to mold-clamping pressure breaking the device
Solution Approach 1:
The height of the heat dissipation block is preliminarily adjusted by controlling the adhesive layer thickness before the molding process. This preliminary height adjustment prevents the heat dissipation block from being too high, which would cause contact with the molding mold and potential device breaking during clamping.
Solution Approach 2:
The adhesive layer serves as a cushioning layer that absorbs height variations. By designing the adhesive layer with appropriate thickness control, the invention prevents excessive height of heat dissipation blocks that would otherwise lead to device damage during molding, thus cushioning against potential failures.
3Reliability
If heat dissipation block height is lower than expected, then device protection is improved, but heat dissipation property deteriorates due to resin covering the heat dissipation block
Solution Approach 1:
The thickness of the adhesive layer is precisely controlled within 5-20 μm to adjust the heat dissipation block height. This parameter control ensures the block is high enough to be exposed on the module surface for effective heat dissipation, while not so high as to cause molding issues.
Solution Approach 2:
The adhesive layer is applied locally between the heat dissipation block and the device, providing localized height adjustment. This ensures that only the necessary area is elevated to achieve proper exposure, maintaining both heat dissipation efficiency and device protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise uniformity of heat dissipation block heights, preventing device damage and ensuring effective heat dissipation, while reducing production defects and steps.
Implementation Method 1
applying a first adhesive having heat dissipation property and thermosetting property onto each of surfaces of a plurality of devices joined to a surface of a substrate, and thereafter mounting heat dissipation blocks, and performing bonding by heat treatment
Implementation Method 2
curing the second adhesives by heat treatment while aligning, by using thicknesses of the second adhesives, heights to surfaces of the second adhesives
Implementation Method 3
applying a first adhesive having heat dissipation property onto each of surfaces of a plurality of devices joined to a surface of a substrate
Data Source
AI summary
A method for manufacturing a semiconductor apparatus includes the steps of: applying a first adhesive having heat dissipation property and thermosetting property onto each of surfaces of a plurality of devices joined to a surface of a substrate, and thereafter mounting heat dissipation blocks, and performing bonding by heat treatment; applying a second adhesive having heat dissipation property and thermosetting property onto each of surfaces of the heat dissipation blocks, so as to be higher than a height A of a molding resin that seals the devices in a later step; and curing the second adhesives by heat treatment while aligning, by using thicknesses of the second adhesives, heights to surfaces of the second adhesives so that the heights are matched with the height A of the molding resin.