Semiconductor Package Block Layout for Faster 3DIC Verification
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Solution Overview
Problem
The challenge in semiconductor manufacturing is to create smaller and more complex integrated circuits while maintaining efficient production and reducing costs, particularly in the context of 3D packaging and 3DIC devices, where existing methods face inefficiencies in verification testing and component integration.
Innovation Solution
A method is introduced for forming semiconductor packages with semiconductor blocks surrounding a semiconductor device, utilizing a substrate with semiconductor dies arranged to form a wall-like structure, followed by flip-bonding, thinning, and encapsulation processes, which includes the formation of a redistribution layer and a MEMS sensor, enhancing sensitivity and reducing size through omission of deep reactive ion etching and wire bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional verification testing methods are used for 3D packaging and 3DIC devices, then testing can be performed, but the process is inefficient and time-consuming
Solution Approach 1:
The patent implements preliminary action by integrating verification testing capabilities directly into the packaging structure during manufacturing. Test structures are built into the substrate and interconnect layers before final assembly, allowing verification to occur as part of the manufacturing process rather than as a separate post-processing step. This eliminates the need for time-consuming external testing equipment and procedures.
2Productivity
If semiconductor devices are made smaller with reduced geometry size, then production efficiency increases and costs decrease, but integration complexity and difficulty of verification increase
Solution Approach 1:
The patent transitions from traditional planar 2D circuit layouts to three-dimensional vertical stacking architectures. Multiple semiconductor devices and interconnect layers are arranged in vertical tiers, allowing increased functional density without proportionally increasing footprint area. This dimensional transition enables continued scaling while managing complexity through spatial organization rather than planar expansion.
Solution Approach 2:
The patent divides the semiconductor package into discrete modular layers including substrate, interconnect layers, and individual device tiers. Each layer can be independently manufactured, tested, and assembled. This segmentation allows verification of individual components before final integration, simplifying the overall verification process despite increased total system complexity.
3Length of moving object
If deep reactive ion etching and wire bonding processes are omitted to reduce size, then device size decreases and sensitivity improves, but manufacturing precision and reliability may be compromised
Solution Approach 1:
The patent replaces traditional mechanical wire bonding processes with direct semiconductor-to-semiconductor bonding interfaces. Conductive interconnect layers are formed through deposition and patterning processes that create integrated circuit traces directly on substrate surfaces, eliminating the need for separate wire bonding steps. This substitution maintains electrical connectivity while reducing overall device dimensions and improving sensitivity.
Data Source
AI summary
A semiconductor package includes a first substrate and a first semiconductor device. The first semiconductor device is bonded to the first substrate and includes a second substrate, a plurality of first dies and a second die. The first dies are disposed between the first substrate and the second substrate. The second die is surrounded by the first dies. A cavity is formed among the first dies, the first substrate and the second substrate, and a gap is formed between the second die and the first substrate.