Semiconductor Package Blocking Pattern Underfill Contamination
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Solution Overview
Problem
Existing semiconductor packages face challenges in preventing foreign substances from reaching the semiconductor chip during fabrication, which can compromise the reliability and quality of the package.
Innovation Solution
A semiconductor package design featuring a light transmissive cover with a conductive pattern, a substrate with a cavity, and a blocking pattern between the light transmissive cover and the substrate, using underfill material like epoxy resin or silicone resin, and bump balls for electrical connections, with the blocking pattern preventing the underfill material from reaching the semiconductor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If underfill material is provided between the light transmissive cover and the substrate, then the package is sealed and protected, but the underfill material may reach and contaminate the semiconductor chip
Solution Approach 1:
The blocking pattern serves as an intermediary structure between the underfill material and the semiconductor chip. It is strategically positioned to intercept and contain the underfill material, preventing it from reaching the chip while still allowing the underfill to provide its sealing and protective functions. This mediator structure resolves the contradiction by enabling the beneficial sealing effect while blocking the harmful contamination path.
Solution Approach 2:
The blocking pattern divides the space between the light transmissive cover and substrate into distinct regions: an underfill material containment region and a chip protection region. This segmentation allows the underfill material to be confined to specific areas where it provides sealing without risking contact with the semiconductor chip, thus resolving the contradiction between sealing effectiveness and contamination prevention.
2Object-affected harmful factors
If the blocking pattern is added to prevent material from reaching the chip, then contamination is prevented, but the device structure becomes more complex
Solution Approach 1:
The blocking pattern is merged with the existing package structure elements (substrate or light transmissive cover) rather than being a completely separate component. It is formed as an integrated feature using the same or compatible materials already present in the package, thus providing contamination prevention while minimizing the increase in structural complexity.
Solution Approach 2:
The blocking pattern is applied locally only where needed to prevent underfill material from reaching the chip, rather than requiring a complete redesign of the entire package structure. This localized approach provides the necessary protection while keeping the overall device complexity minimal, as only specific strategic locations are modified.
Data Source
AI summary
A semiconductor package includes a light transmissive cover having a conductive pattern, a substrate having a cavity, a semiconductor chip in the cavity of the substrate and electrically connected to the conductive pattern arranged on the light transmissive cover, and a blocking pattern between the light transmissive cover and the substrate.