Semiconductor Body Detachment via Tethers for LED Manufacturing
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Solution Overview
Problem
The production of semiconductor components using standard die bonding techniques for area lighting with LEDs is time-consuming and expensive due to the need for numerous small LEDs to be die bonded on a carrier.
Innovation Solution
A method involving a substrate with a semiconductor layer sequence, where the layer sequence is structured into semiconductor bodies with tethers that allow for local detachment from the substrate, enabling cost-effective and simplified production by using a laser lift-off or etching process to separate the semiconductor bodies for transfer to a carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If standard die bonding techniques are used to bond numerous small LEDs on a carrier for area lighting, then the lighting function is achieved, but the production process becomes time-consuming and expensive
Solution Approach 1:
The invention divides the semiconductor layer sequence into multiple individual semiconductor bodies (LEDs) that are grown separately on a single substrate. Each semiconductor body can be individually detached and transferred to the carrier, eliminating the need for time-consuming die bonding of numerous small LEDs while maintaining area lighting functionality
Solution Approach 2:
The semiconductor bodies are pre-grown on the substrate in an organized array before detachment. This preliminary growth phase allows for efficient batch processing, and the tether structures are pre-formed to facilitate subsequent easy detachment and transfer operations
2Ease of manufacture
If numerous small LEDs are die bonded on a carrier using standard methods, then area lighting is achieved, but the process becomes complex and expensive
Solution Approach 1:
Multiple semiconductor bodies are grown simultaneously on a single substrate in an organized array, merging the fabrication process into a single batch operation. The tether structures combine mechanical support and electrical connection functions, simplifying the overall device architecture and reducing manufacturing steps
Solution Approach 2:
The tether structures serve as intermediary elements that temporarily hold the semiconductor bodies on the substrate during fabrication and then facilitate their transfer to the carrier. These tethers simplify the detachment and transfer process by providing a controlled release mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies and cost-reduces the production of semiconductor components by allowing for efficient detachment and transfer of semiconductor bodies, reducing the complexity and expense associated with standard die bonding techniques.
Implementation Method 1
The substrate is locally detached from the semiconductor bodies, in particular by means of a laser lift-off process
Implementation Method 2
or by means of an etching process
Data Source
AI summary
A method for producing a plurality of semiconductor components and a semiconductor component are disclosed. In an embodiment the component includes a light transmissive carrier, a semiconductor body disposed on the light transmissive carrier, the semiconductor body including a first semiconductor layer, a second semiconductor layer and an active region being arranged between the first semiconductor layer and the second semiconductor layer, wherein the semiconductor body includes a first patterned main surface facing the light transmissive carrier and a second main surface facing away from the carrier and a contact structure including a first contact area and a second contact area arranged on the second main surface, wherein the second contact area is electrically connected to the second semiconductor layer, and wherein the contact structure comprises a via extending from the second main surface throughout the second semiconductor layer and the active region into the first semiconductor layer.