Semiconductor Device Bond Wire Interconnect Architecture
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Solution Overview
Problem
The high material and process costs associated with using printed circuit boards in power electronic modules, such as chopper modules, for electrical coupling of semiconductor components like IGBT and diode chips, necessitate a cost-effective alternative for fabricating these modules.
Innovation Solution
A semiconductor device design that eliminates the conventional printed circuit board by using bond wires to electrically couple IGBT substrates to control substrates via diode substrates, with control signals routed through additional pads on the diode substrates, thereby reducing the need for an additional printed circuit board and maximizing chip area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a printed circuit board is used to electrically couple semiconductor components, then reliable electrical connections are achieved, but material costs and process costs increase
Solution Approach 1:
The patent extracts and eliminates the printed circuit board from the power electronic module structure, replacing it with direct wire bonding connections between substrates. This removal of the PCB layer reduces both material costs and manufacturing complexity while maintaining electrical connectivity through alternative bonding methods
Solution Approach 2:
The patent merges the electrical connection function previously performed by the printed circuit board directly into the substrate assembly through wire bonding. By combining the substrate mounting and electrical interconnection into a single integrated structure, the need for a separate PCB layer is eliminated, reducing overall module complexity and cost
2Adaptability or versatility
If a printed circuit board is used for electrical coupling, then component interconnection is achieved, but device complexity increases
Solution Approach 1:
The printed circuit board is extracted from the module architecture, simplifying the overall structure by removing an entire layer of complexity. The electrical interconnection function is retained through direct wire bonding between substrates, maintaining adaptability while reducing structural complexity
Solution Approach 2:
The patent transitions from a planar PCB-based interconnection approach to a three-dimensional wire bonding approach that routes connections vertically and diagonally between substrates. This dimensional change allows for complex electrical interconnections without requiring additional planar layers, thereby reducing overall device complexity
3Reliability
If conventional substrate coupling methods are used, then electrical connections are established, but chip area is reduced
Solution Approach 1:
The patent utilizes three-dimensional wire bonding techniques that route connections through the vertical dimension rather than consuming horizontal chip area. This allows electrical connections to be established without occupying valuable chip surface area, maximizing the active chip area available for functional circuits
Data Source
AI summary
A semiconductor device includes a baseplate and a first and a second insulated gate bipolar transistor (IGBT) substrate coupled to the baseplate. The semiconductor device includes a first and a second diode substrate coupled to the baseplate and a first, a second, and a third control substrate coupled to the baseplate. Bond wires couple the first and second IGBT substrates to the first control substrate. Bond wires couple the first and second IGBT substrates to the second control substrate via the first and second diode substrates, and bond wires couple the first and second IGBT substrates to the third control substrate via the second diode substrate.