Semiconductor Bonding Electrode Dummy Structure
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Solution Overview
Problem
Existing semiconductor devices face challenges in suppressing substrate deformation and ensuring sufficient load application during bonding, as the load is dispersed across bonding and dummy electrodes, limiting the performance improvement of bonding devices.
Innovation Solution
A semiconductor device configuration featuring a bonding electrode and a dummy electrode with specific surface area and thickness ratios, where the dummy electrode has a smaller contact area and thinner pads than the bonding electrode, allowing for more focused load application and reduced deformation, while being formed in the same process to simplify manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If dummy electrodes are arranged in regions with low bonding electrode density to suppress substrate deformation, then substrate deformation is suppressed, but the load is dispersed and sufficient load cannot be applied to bonding electrodes
Solution Approach 1:
The dummy electrode is designed with a specific geometric configuration where the pad thickness varies in different regions. The pad has a first thickness in the region facing the bonding electrode and a second thickness in other regions, creating local quality differences that allow the dummy electrode to provide structural support while minimizing load interference with the bonding electrode.
Solution Approach 2:
The dummy electrode structure is made asymmetric by varying the pad thickness across different regions. This asymmetric design allows the dummy electrode to fulfill its dual function of suppressing substrate deformation and minimizing load dispersion, as the thinner regions reduce mechanical interference while the thicker regions provide adequate structural support.
2Reliability
If the load is increased to ensure sufficient connection between bonding electrode and substrates, then bonding connection is improved, but the performance improvement is limited by the bonding device load generation capability
Solution Approach 1:
The dummy electrode is extracted as a separate functional element from the bonding electrode structure. By isolating the load-bearing function to the bonding electrode and the substrate support function to the dummy electrode, the design allows the bonding electrode to receive focused load without dispersion, improving bonding connection reliability without requiring excessive load generation from the bonding device.
3Ease of manufacture
If bonding electrode and dummy electrode are formed in the same process, then manufacturing process is simplified, but the structural precision and differentiation between electrodes must be maintained
Solution Approach 1:
The dummy electrode structure is designed with predetermined geometric features, including specific pad thickness variations, that are established during the formation process. This preliminary design of the structural configuration allows the electrodes to be formed in the same process while maintaining the necessary structural differentiation through controlled material deposition and patterning steps.
Data Source
AI summary
A semiconductor device includes a first semiconductor substrate, a second semiconductor substrate, a bonding electrode, and a dummy electrode. The first semiconductor substrate has a first surface and a first wiring, and contains a first semiconductor material. The second semiconductor substrate has a second surface and a second wiring, and contains a second semiconductor material, and the first surface and the second surface face each other. The bonding electrode is arranged between the first surface and the second surface, and is electrically connected to the first wiring and the second wiring. The dummy electrode is arranged between the first surface and the second surface, and is electrically insulated from at least one of the first wiring and the second wiring. The bonding electrode has a bonding bump and a first bonding pad. The dummy electrode has a dummy bump and a first dummy pad.