Bonding Condition Evaluation Apparatus for Semiconductor NCF
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing bonding methods for semiconductor chips and substrates using thermosetting bonding members require trial and error to determine optimal heating conditions, which are inefficient due to the difference in heat transfer characteristics and physical properties when the combination of members changes, especially under rapid heating conditions.
Innovation Solution
An apparatus that includes a bonding unit, a library of viscosity characteristic information for various bonding members, an initial evaluation condition determination unit, and a bonding evaluation unit to determine and adjust bonding conditions based on the correlation between viscosity and heating conditions in a transient state, allowing for efficient derivation of bonding conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If trial and error method is used to determine bonding conditions, then bonding conditions can be determined for different member combinations, but the number of trials increases and efficiency decreases
Solution Approach 1:
The patent pre-measures and stores viscosity-temperature characteristics of bonding members at various heating rates before actual bonding operations. This preliminary data collection allows the system to predict appropriate bonding conditions for different member combinations without requiring extensive trial and error during production, thereby improving efficiency while maintaining adaptability.
Solution Approach 2:
The patent implements a feedback mechanism where viscosity measurement results from actual bonding operations are used to refine and update the stored viscosity characteristic data. This continuous improvement of the database enables more accurate prediction of bonding conditions for future operations, reducing the number of trials needed while adapting to new member combinations.
2Loss of information
If steady state viscosity characteristics are used for bonding condition determination, then some guidance can be provided, but the characteristics differ significantly from transient state during rapid heating
Solution Approach 1:
The patent changes the measurement parameter from steady-state viscosity (measured at slow heating rate of 10°C/min) to transient-state viscosity characteristics by measuring viscosity at multiple heating rates (3°C/sec, 5°C/sec, 10°C/sec, etc.). This parameter change allows the system to capture the actual viscosity behavior during rapid heating processes, providing accurate guidance for bonding condition determination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the efficient derivation of bonding conditions by determining initial evaluation conditions using transient state viscosity information, reducing the number of trials and improving the efficiency of the bonding process.
Implementation Method 1
the semiconductor chip is heated under heating conditions in which the bonding member reaches a curing temperature before the metal bumps reach a melting start temperature
Implementation Method 2
the bonding member needs to be softened to fill a gap between the semiconductor chip and the substrate before metal bumps provided on the semiconductor chip are thermally melted
Implementation Method 3
metal bumps provided on the semiconductor chip are thermally melted
Data Source
AI summary
The apparatus which assists in deriving bonding conditions includes a bonding unit which bonds a semiconductor chip and a substrate by applying heat and pressure with NCF interposed therebetween, a library in which a variety of physical property information including viscosity characteristic information is collected with respect to each of a plurality of types of NCFs, an initial evaluation condition determination unit which acquires the physical property information corresponding to the NCF used for bonding with reference to the library and determines an initial value of an evaluation condition of bonding evaluation performed by bonding the semiconductor chip and the substrate, and a bonding evaluation unit which drives the bonding unit in accordance with set evaluation condition, bonds the semiconductor chip and the substrate and performs the bonding evaluation at least once to measure the viscosity of the NCF at the time of the bonding.