Stacked Semiconductor Apparatus Bonding Face Corrosion Prevention
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Solution Overview
Problem
The existing semiconductor apparatus with a three-dimensional structure faces issues with internal space formation between stacked components due to uneven metal pad distribution, leading to potential corrosion from external moisture and foreign substances.
Innovation Solution
The semiconductor apparatus is designed with specific arrangements of openings and bonding portions on the bonding faces of stacked components, ensuring that the internal space is isolated from the outside by strategically placing bonding portions between openings, thereby preventing moisture ingress and enhancing bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metal pads are formed using damascene method with CMP polishing, then metal pads can be formed in recess portions, but high density portions are excessively polished causing non-planar bonding face and internal space formation
Solution Approach 1:
The patent applies preliminary action by forming a filler material in the recess portions before CMP polishing. This filler material protects the metal pads during polishing, preventing excessive removal of metal from high density portions. The filler is removed after polishing, leaving the metal pads with their original dimensions intact and the bonding face properly planarized.
2Productivity
If internal space is formed between stacked semiconductor components, then stacking is achieved, but water or foreign substances can enter through openings and cause metal pad corrosion
Solution Approach 1:
The patent applies the taking out principle by strategically removing (forming openings in) specific regions of the insulating layer that are far from the metal pads, while maintaining the insulating layer intact in regions close to the metal pads. This creates openings for necessary connections while preserving the protective barrier against moisture and foreign substances at critical locations.
Solution Approach 2:
The patent applies local quality by making the insulating layer have different properties in different regions: in regions close to metal pads, the insulating layer remains intact to provide protection against corrosion, while in regions far from metal pads, openings are formed to enable electrical connections. This spatially varying structure optimizes both protection and connectivity.
3Adaptability or versatility
If openings are formed to pass through bonding face, then electrical connections are enabled, but internal space communicates with outside allowing moisture ingress
Solution Approach 1:
The patent applies local quality by creating a non-uniform distribution of openings in the insulating layer. Openings are strategically positioned only in regions that are far from the metal pads, while regions close to metal pads maintain the intact insulating layer. This spatial differentiation enables electrical connections where needed while preserving corrosion protection where critical.
Solution Approach 2:
The patent uses the insulating layer as an intermediary barrier between the openings and the metal pads. By maintaining the insulating layer in regions adjacent to metal pads, it acts as a protective mediator that prevents direct exposure of metal pads to moisture and foreign substances that could enter through openings located in other regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement effectively suppresses corrosion and improves the bonding strength between semiconductor components, resulting in a high-quality and cost-effective semiconductor apparatus.
Implementation Method 1
the first insulating layer and the second insulating layer are bonded to each other
Data Source
AI summary
A semiconductor apparatus includes included first and second semiconductor components which are stacked on each other. The first component includes a first insulating layer and a first plurality of metal pads. The second component includes a second insulating layer and a second plurality of metal pads. Each of the first plurality of metal pads and each of the second plurality of metal pads are bonded to each other to form each of a plurality of bonding portions. First and second openings along an edge of the apparatus and passing through a bonding face between the first and second insulating layer are formed in the apparatus. A first bonding portion between the first opening and the second opening of the plurality of bonding portions is arranged in a distinctive location.