Semiconductor Device Bonding Wire Adhesion via Silane Paste
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Solution Overview
Problem
Conventional semiconductor devices experience poor adhesiveness between bonding wires and resin encapsulants, leading to separation, especially when the resin is moistened, and poor bonding strength between bonding wires and lead terminals due to the hygroscopic nature of epoxy resin and the wedge-like shape of the second bonding portion.
Innovation Solution
Interposing an insulating paste containing nanometer-sized insulating particles and an organosilicon compound, such as alkyl alkoxy silane or organopolysiloxane, at the interface between bonding wires and the resin encapsulant to enhance adhesion and bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires are bonded to lead terminals at an angle (wedge-like shape), then electrical connection is achieved, but bonding strength deteriorates due to poor adhesion
Solution Approach 1:
An insulating paste is introduced as an intermediary material at the interface between the bonding wire and the resin encapsulant. This paste contains silane-modified epoxy resin that chemically bonds to the bonding wire surface, creating a strong adhesive interface that prevents separation and enhances bonding strength despite the angled wedge-like bonding geometry.
Solution Approach 2:
The insulating paste is formulated as a composite material combining silane-modified epoxy resin with specific additives to achieve both electrical insulation and strong adhesion to the bonding wire. This composite structure provides improved bonding strength while maintaining the necessary electrical isolation properties.
2Reliability
If resin encapsulant is used to encapsulate bonding wires, then protection and insulation are provided, but adhesiveness deteriorates due to hygroscopic nature causing separation when moistened
Solution Approach 1:
The insulating paste serves as a moisture-resistant intermediary layer between the bonding wire and the hygroscopic resin encapsulant. This intermediate layer prevents moisture from penetrating to the bonding interface, thereby preventing separation while still allowing the resin to provide its protective and insulating functions.
Solution Approach 2:
The insulating paste modifies the chemical and physical parameters at the bonding interface by introducing hydrophobic silane groups that resist moisture absorption. This parameter change in the interface material prevents the harmful hygroscopic effects from propagating to the bonding wire-resin interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents separation between bonding wires and resin encapsulants and improves bonding strength between bonding wires and lead terminals, ensuring reliable electrical connections even under varying environmental conditions.
Implementation Method 1
an insulating paste that contains a nanometer-sized insulating particle and an organosilicon compound
Data Source
AI summary
Disclosed is a semiconductor device that includes a semiconductor chip; bonding pads provided to the semiconductor chip; a plurality of lead terminals arranged around the semiconductor chip; a plurality of bonding wires that electrically connect the semiconductor chip with the plurality of lead terminals; and a resin encapsulant which encapsulates the semiconductor chip and the bonding wires, the semiconductor device further having an insulating material interposed at the interface between the bonding wires and the resin encapsulant, and the insulating material containing a nanometer-sized insulating particle and amorphous silica.