Semiconductor Processing Device Bubble Mixing for Uniform Chemical Distribution
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Solution Overview
Problem
In semiconductor processing, variations in chemical flow rates near nozzles lead to uneven processing rates and potential precipitation of by-products on semiconductor substrates due to non-uniform chemical distribution.
Innovation Solution
A semiconductor processing device with gas and chemical supply pipes that create air bubbles to uniformly distribute chemicals across the substrate surface, using valves and pumps to control flow rates and directions, ensuring consistent processing and preventing by-product precipitation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If chemical is supplied through nozzles to circulate in the processing tank, then the chemical concentration is maintained uniform, but the flow rate varies significantly near the nozzle causing non-uniform processing rates and by-product precipitation
Solution Approach 1:
The single nozzle is divided into multiple nozzles arranged in a specific pattern. This segmentation allows the chemical to be supplied from multiple locations, distributing the flow more evenly across the substrate surface and reducing the extreme flow rate variations that occur with a single nozzle.
Solution Approach 2:
Different regions of the substrate receive chemically treated flows tailored to their specific needs. The nozzle arrangement and chemical supply strategy are optimized for different zones (center vs. periphery) to achieve uniform processing rates across the entire substrate surface.
2Productivity
If chemical flow rate is high near the nozzle, then chemical supply efficiency is improved, but processing rate variation increases and by-product precipitation occurs in low flow regions
Solution Approach 1:
The system dynamically adjusts chemical supply parameters including flow rates, nozzle positioning, and timing to optimize both supply efficiency and prevent by-product precipitation. The chemical supply is controlled to maintain appropriate flow rates in different regions throughout the processing cycle.
Solution Approach 2:
The chemical supply operates in periodic cycles with controlled duration and intensity. This periodic action allows the chemical to be supplied efficiently while preventing excessive accumulation and subsequent by-product precipitation on the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform processing rates across the substrate surface, reducing by-product precipitation and maintaining consistent chemical distribution, thereby enhancing processing efficiency and substrate quality.
Implementation Method 1
A gas supply part is provided below the semiconductor substrate accommodated in the processing tank and is configured to supply air bubbles to the chemical from below the semiconductor substrate
Implementation Method 2
A chemical supply part is provided above the gas supply part and below the semiconductor substrate and is configured to discharge the chemical caused to circulate from the processing tank, towards the air bubbles appearing from the gas supply part
Data Source
AI summary
A semiconductor processing device according to an embodiment includes a processing tank configured to store a chemical therein to allow a semiconductor substrate to be immersed in the chemical. A gas supply part is provided below the semiconductor substrate accommodated in the processing tank and is configured to supply air bubbles to the chemical from below the semiconductor substrate. A chemical supply part is provided above the gas supply part and below the semiconductor substrate and is configured to discharge the chemical caused to circulate from the processing tank, towards the air bubbles appearing from the gas supply part.