Semiconductor Calibration Standard for Thin Layer Measurement
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Solution Overview
Problem
Existing calibration standards for non-destructive measurement of thin layers, particularly in the lower thickness range, face issues due to the use of ductile and rough-surfaced plastic films which can lead to distortion and inaccuracies during the measurement process.
Innovation Solution
A calibration standard is achieved through a permanent adhesion of the standard to the carrier layer via plating, eliminating the need for bonding agents and ensuring a secure, plane-parallel configuration, with a semiconductor insulation layer providing high precision and low surface roughness, and optionally using auxiliary poles for precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If plastic films such as polyethylene terephthalate are used as carrier layer, then the calibration standard can be produced, but the ductile and rough surface of the film causes distortion and reduces measurement precision in the lower thickness range
Solution Approach 1:
The patent changes the material parameter from ductile plastic film to rigid semiconductor wafer, fundamentally altering the surface properties. The semiconductor wafer provides a rigid, flat surface with controlled roughness, eliminating the distortion caused by ductile material deformation while maintaining the carrier layer function.
Solution Approach 2:
The patent creates a composite structure combining semiconductor wafer (carrier layer) with standard layer, where the semiconductor wafer provides the rigid substrate and the standard layer provides the measurement reference. This composite approach leverages the advantages of both materials: the rigidity of semiconductor and the measurement functionality of the standard layer.
2Reliability
If bonding agents are used to attach standard to carrier layer, then the standard can be securely fixed, but the bonding agent creates additional build-up that distorts the reproduced layer thickness
Solution Approach 1:
The patent removes the bonding agent from the system entirely. Instead of using adhesive materials to attach the standard to the carrier layer, the invention uses direct mechanical contact and friction between the standard layer and semiconductor wafer surface, eliminating the build-up distortion caused by bonding agents.
Solution Approach 2:
The patent introduces friction and mechanical contact as an intermediary mechanism between the standard layer and carrier layer, replacing the bonding agent. This friction-based attachment provides secure fixing without adding material thickness, maintaining measurement accuracy.
3Ease of manufacture
If plastic film is used as carrier layer, then the calibration standard can be produced, but the ductile nature of the material causes warping and buckling of the surface
Solution Approach 1:
The patent changes the material parameter from ductile plastic to rigid semiconductor, fundamentally altering the mechanical stability. The rigid semiconductor wafer maintains its shape and surface plane-parallel configuration without warping or buckling, while still being easy to manufacture as a standard component.
Solution Approach 2:
The patent uses a composite structure where the semiconductor wafer provides rigid, stable support and the standard layer provides the measurement function. This combination achieves both ease of manufacture and long-term stability without warping.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides high precision and repeating accuracy in calibration, minimizing distortions and ensuring accurate measurements across a wide range of layer thicknesses from 10 μm to 1,000 μm with minimal deviation, even after repeated use.
Implementation Method 1
it will be possible to provide—without bonding agents or other additives—a connection between the standard and the carrier layer by adhesion
Implementation Method 2
After plating by rubbing and positioning of the standard on the carrier layer, a type of cold welding will result with an increasing duration of time
Data Source
AI summary
The invention relates to a calibration standard, especially for the calibration of devices for the non-destructive measurement of the thickness of thin layers, with a carrier layer (12) consisting of a basic material and a standard (17) applied on the carrier layer (12), said standard having the thickness of the layer to be measured at which the device is to be calibrated, with the carrier layer (12) comprising a plane-parallel measuring surface (16) to its bearing surface (14), that the standard (17) comprises a bearing surface (18) plane-parallel with its measuring surface (19) for bearing on the measuring surface (16) of the carrier layer (12), and that the standard (17) is permanently provided on the carrier layer (12) by means of plating by rubbing.