Semiconductor Capacitor Bank Layout for Adjustable Capacitance

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Solution Overview

Problem

Existing capacitor structures in semiconductor circuits lack flexibility in adjusting capacitance to meet varying practical application requirements, leading to potential stability issues and suboptimal performance.

Innovation Solution

A semiconductor structure design that includes a first wire, second wire, and conducting layers with capacitor banks and reserved second conducting layers, allowing for flexible adjustment of capacitance by connecting via holes to adjust capacitor configurations without altering the entire structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a fixed capacitor structure is used, then the manufacturing process is simple, but the capacitance cannot be adjusted to meet varying practical application requirements

Engineering Contradiction:
Improvecapacitance adjustabilityVSAvoidstructure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The capacitor structure is divided into multiple capacitor banks, each with adjustable connections to capacitor plates. This segmentation allows selective activation of different capacitor units to achieve varying total capacitance values, resolving the contradiction between adaptability and complexity by enabling adjustment through modular configuration rather than redesigning the entire structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements dynamic capacitance adjustment by allowing selective electrical connection between capacitor banks and capacitor plates through controllable switches or connection mechanisms. This dynamic reconfiguration capability enables the capacitor structure to adapt its total capacitance value based on circuit requirements while maintaining a fixed physical structure, thus achieving adaptability without proportionally increasing structural complexity.

Inventive Principle:
Principle #15Dynamics

2Reliability

If the entire capacitor structure is redesigned to adjust capacitance, then the capacitance can be optimized, but the manufacturing complexity and time increase significantly

Engineering Contradiction:
Improvepotential stabilityVSAvoidmanufacturing flexibility
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The capacitor structure is manufactured with pre-positioned capacitor banks and capacitor plates in a fixed physical arrangement. The adaptability for capacitance adjustment is built into the design through pre-established connection points and switchable pathways, allowing capacitance optimization to be achieved through electrical configuration rather than physical redesign. This preliminary structuring maintains manufacturing simplicity while enabling post-manufacturing flexibility.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent enables capacitance adjustment by changing electrical connection parameters (which capacitor banks connect to which plates) rather than changing physical structural parameters. This approach allows optimization of capacitance values for different applications while maintaining the same manufactured structure, thus improving reliability through parameter adjustment without increasing manufacturing complexity.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If multiple capacitor configurations are provided for different applications, then the adaptability increases, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvecapacitance configuration flexibilityVSAvoidoperation simplicity
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The patent designs a universal capacitor structure where a single physical configuration of capacitor banks and plates can serve multiple capacitance requirements through different connection configurations. This multi-functionality is achieved by providing switchable connection pathways that allow the same hardware to be configured for different total capacitance values, thus maintaining ease of operation while achieving high adaptability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The capacitor structure incorporates self-service adjustment mechanisms where the selection of different capacitance values is achieved through automatic or semi-automatic connection switching based on detected circuit requirements. This reduces the operational burden on users while maintaining high adaptability, as the system can autonomously or semi-autonomously configure the appropriate capacitance without requiring complex manual reconfiguration.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables flexible adjustment of capacitance to enhance stability and responsiveness of potential differences, improving circuit performance by increasing capacitance where needed, while maintaining structural integrity and simplifying manufacturing processes.

Implementation Method 1

Capacitors can store energy. Therefore, in circuit design, circuit designers usually add a large number of capacitors between various potentials. Moreover, by utilizing the charging and discharging characteristics of a capacitor, the stability of potentials of two electrodes of the capacitor can be enhanced.

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS12581944B2Semiconductor structure
Publication Date: 2026.03.17 CHANGXIN MEMORY TECH INC
  • US12581944B2 patent drawing
  • US12581944B2 patent drawing
  • US12581944B2 patent drawing

AI summary

A semiconductor structure includes: at least one first conducting layer between a first wire and a second wire; a plurality of capacitor banks respectively located on the first wire, the second wire, or the first conducting layer, and two capacitor banks are located on each first conducting layer; a third wire is located above and connected to the first wire through a via hole, and a fourth wire is located above and connected to the second wire through a via hole; at least one capacitor plate located on the second electrode layer, and second electrode layers of two adjacent capacitor banks are electrically connected to a same capacitor plate; at least one second conducting layer located between the third wire and the fourth wire, and an orthographic projection of the second conducting layer on a plane on which the capacitor plates are located is located between two adjacent capacitor plates.