Semiconductor Capacitor Interface Stack for Thin Dielectric Leakage Control

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Solution Overview

Problem

Capacitors in semiconductor devices face a challenge in achieving high electrostatic capacitance while minimizing leakage currents, as reducing the thickness of the dielectric layer increases leakage currents.

Innovation Solution

A capacitor structure is developed with a primary lower electrode, an interface structure comprising sequentially stacked first, second, and third interface layers, and a primary dielectric layer, where the interface layers are doped with specific metals and nitrogen to enhance conductivity and reduce leakage, and the dielectric layer includes a tetravalent metal oxide to maintain capacitance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the thickness of the dielectric layer is decreased to increase electrostatic capacitance, then the capacitance is improved, but the leakage current increases

Engineering Contradiction:
Improveelectrostatic capacitanceVSAvoidleakage current
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The interface structure is divided into three distinct interface layers (first, second, and third interface layers) with different material compositions and doping levels. This segmentation allows each layer to perform specific functions: the first layer provides basic interface quality, the second layer enhances conductivity through pentavalent element doping, and the third layer further optimizes the interface with nitrogen doping, collectively reducing leakage current while maintaining thin dielectric layer performance

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the interface structure are doped with different elements at different concentrations to create localized properties. The first interface layer uses pentavalent element doping for local conductivity enhancement, while the third interface layer uses nitrogen doping for specific interface quality improvement. This local quality optimization allows the thin dielectric layer to maintain low leakage current without sacrificing capacitance

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed structure effectively decreases leakage currents while maintaining high capacitance by optimizing the conductivity of the interface layers and the dielectric properties of the dielectric layer, improving the overall electrical characteristics of the capacitor.

Implementation Method 1

The first interface layer may have electrical conductivity, and may include a second metal oxide doped with a pentavalent element

Methodology Applied
Scientific EffectDoping: Dopants

Implementation Method 2

The second interface layer may be on the first interface layer, and may include a material further doped with nitrogen in the material of the first interface layer

Methodology Applied
Scientific EffectDoping: Dopants

Implementation Method 3

The third interface layer may be on the second interface layer, and may include a third metal oxide doped with nitrogen

Methodology Applied
Scientific EffectDoping: Dopants

Implementation Method 4

a primary dielectric layer including a first metal oxide on the interface structure

Methodology Applied
Scientific EffectDielectric permittivity: Dielectric Permittivity

Data Source

PatentUS20240387608A1Capacitor and semiconductor device including the same
Publication Date: 2024.11.21 SAMSUNG ELECTRONICS CO LTD
  • US20240387608A1 patent drawing
  • US20240387608A1 patent drawing
  • US20240387608A1 patent drawing

AI summary

A capacitor may include a primary lower electrode, an interface structure on a surface of the primary lower electrode, a primary dielectric layer including a metal oxide on the interface structure, the primary dielectric layer, and an upper electrode on the primary dielectric layer. The interface structure may include a first interface layer, a second interface layer, and a third interface layer. The first interface layer may have electrical conductivity, and may include a metal oxide doped with a pentavalent element. The second interface layer may be on the first interface layer, and may include a material further doped with nitrogen in the material of the first interface layer. The third interface layer may be on the second interface layer, and may include a metal oxide doped with nitrogen. A metal included in the metal oxide of the third interface layer may include a tetravalent metal.