Semiconductor Carrier Structure with Adhesive-Filled Cavities
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Solution Overview
Problem
Conventional carrier structures for semiconductor chips face issues with warping and burr formation during cutting, leading to low yield and stability, especially when made of organic resins, and metal carriers result in poor appearance and tool damage due to metal burrs.
Innovation Solution
A carrier structure comprising a metal plate with adhesive material on both surfaces and cavities, where semiconductor chips are embedded, and etching grooves are filled with adhesive material to prevent warping and burr formation, using a metal plate that is laminated with multiple adhesive layers to ensure structural integrity and prevent loosening during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the carrier is made of organic resins such as BT, then the carrier can be easily cut, but the carrier becomes warped due to asymmetric stress from the built-up structure
Solution Approach 1:
The patent uses a composite structure consisting of a metal carrier plate combined with adhesive layers and semiconductor chips. The metal carrier provides rigidity and resistance to warping, while the adhesive layers bond the components together. This composite approach combines the cutting ease of processed materials with the warping resistance of metal, resolving the contradiction between ease of manufacture and structural stability.
2Strength
If the carrier is made of metal, then the carrier has better strength for anti-warp, but metal burrs will be generated causing poor appearance and damage to the cutting tool
Solution Approach 1:
The patent removes the problematic metal carrier plate from the final product after it has served its purpose as a stable substrate during manufacturing. The carrier plate is used temporarily to provide warping resistance during assembly, then extracted or removed, leaving only the adhesive-bonded semiconductor chip structure. This eliminates the burr generation issue while maintaining the anti-warp strength benefit during the critical manufacturing phase.
3Strength
If the carrier is made of metal, then the carrier has better strength for anti-warp, but the metal burrs will cause damage to the carrier structure embedded with semiconductor chips
Solution Approach 1:
The metal carrier plate is extracted or removed after serving its temporary function of providing structural stability during assembly. This eliminates the source of metal burrs that would otherwise damage the semiconductor chips and carrier structure, while the anti-warp strength benefit is retained during the critical manufacturing and assembly phases.
Solution Approach 2:
The adhesive layers serve as intermediary materials between the metal carrier plate and the semiconductor chips. These adhesives protect the chip surfaces during assembly on the metal carrier, preventing direct contact with any potential metal burrs while still allowing the metal carrier to provide its warping resistance function.
Data Source
AI summary
Carrier structure embedded with semiconductor chips and method for manufacturing the same are disclosed. The carrier structure comprises a metal plate and pluralities of semiconductor chips. An adhesive material is disposed on both surfaces of the metal plate, and pluralities of cavities are formed through the metal plate. The semiconductor chips are embedded in the cavities and mounted in the metal plate. The semiconductor chips each have an active surface on which pluralities of electrode pads are disposed. A built-up structure is formed on the surface of the carrier structure and the active surfaces of the semiconductor chips, which has pluralities of conductive vias therein to conduct the semiconductor chips, and has pads thereon. Besides, the metal plate has an etching cavity between the semiconductor chips, and the etching cavity is filled with the adhesive material. The present invention solves the problem of metal burrs being formed when cutting.