Semiconductor Carrier Perimeter Adhesive Segmentation
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Solution Overview
Problem
Conventional carrier tapes for semiconductor workpieces lead to delamination and damage due to strong adhesive bonds, requiring frequent die removal and resulting in reduced adhesive strength, which can cause delamination from the substrate or leadframe.
Innovation Solution
A semiconductor workpiece carrier assembly with a support structure and a replaceable carrier having an adhesive layer only on the perimeter, allowing direct attachment of dies to the carrier without bonding with the adhesive, enabling selective detachment and reuse of the carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional carrier tapes with adhesive layers are used to support semiconductor dies, then the dies can be temporarily stored and transported, but the adhesive bond between the die attach adhesive and carrier tape adhesive strengthens over time causing delamination and damage when dies are removed
Solution Approach 1:
The carrier tape is segmented into two distinct adhesive layers: a first adhesive layer on the die attach adhesive that provides initial bonding, and a second adhesive layer on the carrier tape base that provides long-term support. This segmentation allows each layer to have optimized properties for its specific function, resolving the contradiction between initial bond strength and long-term storage stability.
Solution Approach 2:
The first adhesive layer acts as an intermediary between the die attach adhesive and the second adhesive layer. It provides a transition zone that manages the bonding forces, preventing the direct strong bond between die attach adhesive and carrier tape adhesive that causes delamination during removal after long storage periods.
2Strength
If the adhesive bond between die attach adhesive and carrier tape adhesive is strong, then the die is securely held during storage, but increased force is required to separate the die causing cracking or damage
Solution Approach 1:
The adhesive system is segmented into multiple layers with different bonding characteristics. The first adhesive layer provides secure holding during storage, while the second adhesive layer is designed to allow cleaner separation, reducing the force needed during die removal and preventing cracking or damage to the delicate semiconductor die.
Solution Approach 2:
The adhesive layers are designed with different bonding parameters - the first adhesive layer has optimized strength for secure holding, while the second adhesive layer has modified properties that facilitate easier separation. This parameter differentiation allows the system to provide both strong holding and safe removal.
3Duration of action of moving object
If dies are stored on carrier tapes for extended periods, then temporary storage needs are met, but sections of carrier tape adhesive remain attached to the die attach adhesive reducing adhesive strength for substrate attachment
Solution Approach 1:
The adhesive system is segmented so that the first adhesive layer on the die attach adhesive is designed to minimize residual adhesion to the second adhesive layer after extended storage. This segmentation ensures that when the die is removed from the carrier tape, the first adhesive layer remains intact on the die attach adhesive without significant contamination from the second adhesive layer, preserving the adhesive strength needed for subsequent substrate attachment.
Data Source
AI summary
Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support structure having an opening sized to receive at least a portion of a semiconductor workpiece, and (b) a replaceable carrier positioned at the opening. The replaceable carrier includes a base and an adhesive layer on the base. The base has a surface, and the adhesive layer covers only a section of the surface of the base. The adhesive layer releasably attaches the replaceable carrier to the support structure.