Semiconductor Case Guiding Projection for Sealing Material Control
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Solution Overview
Problem
Semiconductor devices face issues with sealing material seepage, leading to contamination and handling difficulties due to the material rising and seeping through openings, compromising the integrity and usability of the devices.
Innovation Solution
Incorporating guiding projection portions and circulatory projection portions on the inner surface of the cover portion of the semiconductor device case, which contact and manage the sealing material to delay its rise and seepage, thereby reducing the amount that reaches the terminal opening and minimizing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sealing material is used to fill the storage area, then the semiconductor module is sealed, but the sealing material rises and seeps through the terminal opening, causing contamination
Solution Approach 1:
A guide projection is introduced as an intermediary structure between the sealing material and the terminal opening. The guide projection extends from the cover portion into the storage area and contacts the sealing material, serving as a mediator that redirects the sealing material's rise path away from the terminal opening, thereby preventing seepage while maintaining sealing effectiveness
Solution Approach 2:
The guide projection is positioned in advance to counteract the harmful effect of sealing material rising toward the terminal opening. By contacting the sealing material before it can reach the terminal opening, the guide projection preemptively blocks the seepage path, preventing contamination before it occurs
2Reliability
If sealing material is used to seal the semiconductor module, then the module is protected, but handling becomes difficult due to seepage and soil
Solution Approach 1:
The guide projection acts as a mediator that intercepts the sealing material's rise, preventing it from reaching the terminal opening and external environment. This maintains the sealing protection function while eliminating the contamination that would otherwise degrade handleability
3Adaptability or versatility
If the cover portion has a terminal opening for lead frame extension, then electrical connection is enabled, but sealing material can seep through this opening
Solution Approach 1:
The guide projection serves as a mediator positioned between the sealing material and the terminal opening. It contacts the sealing material and redirects its rise path, allowing the terminal opening to remain open for electrical connection while preventing sealing material seepage through the opening
Solution Approach 2:
The guide projection creates a localized modification in the sealing material's behavior by contacting it at a specific position. This local intervention redirects the sealing material's rise path away from the terminal opening, enabling the opening to maintain its electrical connection function without compromising sealing
Data Source
AI summary
A semiconductor device, including a board, a semiconductor module disposed on a front surface of the board, and a case that includes (1) side wall portions that are disposed on the front surface of the board and that surround, with the board, a storage area including the semiconductor module, (2) a cover portion that is disposed on the side wall portions to cover the storage area, the cover portion having a terminal opening formed therein, and (3) a guiding projection portion formed on an inner surface of the cover portion, and protruding toward the storage area. The semiconductor device further includes sealing material with which the storage area is filled and which seals the semiconductor module. The guiding projection portion has a projecting end portion that is in contact with the sealing material.