Semiconductor Casing Thick Portion Resin Breakage
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Solution Overview
Problem
In semiconductor devices, the terminal portion can become inclined or move when fastening torque is applied, causing stress on the surrounding resin casing, which may lead to breakage.
Innovation Solution
The semiconductor device design includes a casing portion with thick resin areas around the terminal's opening and a slit portion that extends outward, along with a protruding portion and a depression in the lid portion, to enhance structural integrity and prevent breakage by distributing the force effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the terminal portion is assembled to the nut glove and fastening torque is applied, then the terminal portion is fixed securely, but the terminal portion becomes inclined or moved and applies force to the surrounding resin casing, which may cause breakage
Solution Approach 1:
The patent applies local quality by creating a thick portion in the resin casing at the specific location surrounding the opening where the terminal portion is assembled. This localized thickening provides additional strength and support precisely where the fastening torque is applied, preventing the terminal portion from inclining or moving and causing breakage, while maintaining normal casing thickness in other areas.
2Strength
If the casing portion thickness is increased around the terminal opening, then the intensity and strength of the casing is improved, but the overall device size and material usage increase
Solution Approach 1:
The thick portion is formed only in the specific area surrounding the opening where the terminal portion is assembled, rather than increasing the overall casing thickness. This localized approach provides the necessary strength and support to prevent breakage under fastening torque while minimizing the increase in overall device volume and material usage.
Data Source
AI summary
Provided is a semiconductor device having: a terminal portion having a through hole is formed on a principal surface portion; and a casing portion in which an opening to make the principal surface portion of the terminal portion exposed is provided, wherein the opening has a corner portion corresponding to a corner of the principal surface portion of the terminal portion, wherein the casing portion has a thick portion, in which thickness of a resin may be greater than that of a middle portion between adjacent corner portions across two sides forming the corner portion, in a surrounding area of the opening. Furthermore, a slit portion extending outward from the corner portion may be formed in the casing portion. At least a part of the outline of the slit portion as viewed from the upper surface direction of the casing portion may be curved.