Semiconductor Cavity Lid Integration for Miniaturization
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Solution Overview
Problem
Conventional metal lid processes for semiconductor devices are limited in miniaturization and require costly, labor-intensive assembly steps, making it difficult to achieve smaller packaging and cost savings.
Innovation Solution
The use of semiconductor material lids, fabricated using semiconductor processes, which can be made smaller with fine details and integrated with shielding properties, and formed over a substrate to create a protective cavity around the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional metal lid processes are used, then shielding properties are provided, but miniaturization is limited and assembly complexity increases
Solution Approach 1:
The patent combines the lid structure with the substrate into a single integrated component. The lid is formed as an extension of the substrate using the same semiconductor manufacturing processes, eliminating the need for separate lid fabrication and assembly steps. This integration directly reduces assembly complexity while enabling smaller packaging dimensions.
Solution Approach 2:
The substrate serves multiple functions: it acts as both the mounting platform for the device and as the material from which the lid is formed. The lid itself provides both mechanical protection and electromagnetic shielding. This multi-functionality reduces the number of separate components needed, thereby simplifying assembly and reducing overall packaging size.
2Object-affected harmful factors
If stamped metal lids are used, then EMI shielding is provided, but manufacturing cost increases and miniaturization is restricted
Solution Approach 1:
The shielding function is merged into the lid structure itself, which is formed from the substrate material. By using highly doped semiconductor material for the lid, the shielding capability is integrated directly into the structural component, eliminating the need for separate shielding materials or additional manufacturing steps, thereby reducing production cost.
Solution Approach 2:
The patent changes the electrical parameters of the semiconductor material by applying high doping concentrations to the lid region. This parameter change transforms the semiconductor material into a material with electromagnetic shielding properties, allowing the lid to provide both mechanical protection and EMI shielding using the same base material, thus simplifying manufacturing.
3Reliability
If stamped metal lids are used, then protection is provided, but assembly labor increases
Solution Approach 1:
The lid formation process is merged with the substrate fabrication process. Both the substrate and the lid are created in the same manufacturing sequence using semiconductor processing techniques, eliminating the need for separate pick-and-place assembly operations. This integration maintains reliable protective cavity formation while dramatically improving assembly efficiency.
4Volume of moving object
If semiconductor material lids are used, then miniaturization and fine details are achieved, but new manufacturing processes are required
Solution Approach 1:
The invention leverages the universality of semiconductor manufacturing processes to achieve multiple objectives. The same process suite used for fabricating the substrate and device components is also used to create the lid structure. This approach enables miniaturization and fine geometric details while avoiding the need for entirely new manufacturing processes, as the existing semiconductor fabrication infrastructure is fully utilized.
Data Source
AI summary
A semiconductor device having a lid, and method of making a semiconductor device having a lid is disclosed. The semiconductor device includes a substrate. A device is positioned at the substrate. A lid made of a semiconductor material is positioned over the device to form a protective cavity about the device. The lid is formed using a semiconductor process. In other examples, the lid may be made of a nonconductive material, such as a polymer material. The lids may be formed as part of a batch process.