Decorative Surface Effects TRIZ Cases
- Micro-fluidic Probe Through-Hole Fabrication via Directional Deposition
Directional deposition forms masking layers on pyramidal pits to etch precise through-holes, reducing manufacturing complexity and cost.
- Semiconductor Cavity Lid Integration for Miniaturization
Fabricating the lid from doped semiconductor material merges shielding and protection, eliminating costly assembly steps required by metal lids.
- MEMS Cavity Capillary Slots for Etching Bubble Removal
Capillary slots in MEMS cavities pull etching agents via capillary action, preventing bubble entrapment that blocks deep cavity access.
- Compliant Micro Device Transfer Head with Spring Arm
Segmented spring arms with integrated electrodes enable parallel micro device transfer while accommodating height variations.